Loading...

NVMFS5C410NT1G

Onsemi

NVMFS5C410NT1G by Onsemi

NVMFS5C410NT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.00092 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,121

-

-

-

-

Digiode

USA . 1,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,222

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 6,651 parts In-Stock

1+ parts

$7.694

100+ parts

-

1k+ parts

-

10k+ parts

-

6,651

$7.694

-

-

-

AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$13.100

100+ parts

-

1k+ parts

-

10k+ parts

-

704

$13.100

-

-

-

Perfect Parts

USA . 5,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,746

-

-

-

-

SupplyDigital Components

Austria . 3,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,723

-

-

-

-

Problanco Electronics

Mexico . 3,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,368

-

-

-

-

Kulean Microsystems

USA . 2,564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,564

-

-

-

-

Corphita

USA . 1,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,038

-

-

-

-

UHIMA Technologies

Türkiye . 721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

721

-

-

-

-

Corohmni

South Africa . 382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

382

-

-

-

-

Kepictronics

USA . 234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

234

-

-

-

-

TANS Electronics

Latvia . 233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

233

-

-

-

-

Overview

Revolutionize your power management solutions with the NVMFS5C410NT1G by Onsemi. As a trusted leader in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed to enhance performance and efficiency. With a range of applications, this N-channel transistor offers unparalleled reliability, precision, and power handling capabilities. Experience the peace of mind knowing that you are investing in a product that delivers exceptional value, benefits, and advantages to meet your power management needs. Upgrade to Onsemi and elevate your power management game today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel type offers better efficiency and lower resistance compared to P-Channel FETs, making it a suitable choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier implementation and protection against reverse polarity, enhancing the overall reliability of the FET.

Surface Mount: YES

Surface mount capability enables easy and compact integration of the FET onto circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 40 V

The high minimum breakdown voltage ensures reliable operation and protection against voltage spikes or surges in the circuit.

Terminal Form: FLAT

Flat terminals provide secure connections and ease of soldering, ensuring reliable electrical contact with external components.

Maximum Pulsed Drain Current (IDM): 900 A

High pulsed drain current rating allows for handling of sudden current surges or spikes, making the FET suitable for demanding applications.

Avalanche Energy Rating (EAS): 578 mJ

High avalanche energy rating indicates the FET's ability to withstand high-energy transient events, ensuring safe operation under varying load conditions.

Maximum Drain Current (Abs) (ID): 300 A

High maximum drain current rating allows for efficient power handling and reliable performance in high-current applications.

Maximum Power Dissipation (Abs): 166 W

High power dissipation rating indicates the FET's capability to dissipate heat effectively, preventing overheating and ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good efficiency and performance, making the FET suitable for a wide range of applications requiring high-speed switching.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows the FET to function reliably in various environmental conditions, enhancing its versatility and suitability for different applications.

Transistor Element Material: SILICON

Silicon material for the transistor element offers good conductivity and durability, ensuring stable performance and long-term reliability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C410NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

578 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

300 A

Maximum Drain Current (ID):

300 A

Maximum Drain-Source On Resistance:

.00092 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

70 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C410NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20