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NVMFS5C410NLWFT1G

Onsemi

NVMFS5C410NLWFT1G by Onsemi

NVMFS5C410NLWFT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0012 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 compliance.

Median Price

$1.650

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 26,500 parts In-Stock

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Verical

USA . 719 parts In-Stock

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$1.750

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719

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$1.750

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Rochester

USA . 719 parts In-Stock

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$1.550

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$1.290

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$1.150

719

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$1.550

$1.290

$1.150

Distributors (In-Stock)

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Flip Electronics

USA . 394,000 parts In-Stock

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Vyrian

USA . 6,433 parts In-Stock

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Digiode

USA . 1,569 parts In-Stock

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Contempo Components LLC

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Microchip USA

USA . 6,484 parts In-Stock

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$9.896

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$9.896

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AZTECH Wire

Italy . 478 parts In-Stock

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$13.200

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Problanco Electronics

Mexico . 5,395 parts In-Stock

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SupplyDigital Components

Austria . 5,259 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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TANS Electronics

Latvia . 1,806 parts In-Stock

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Kulean Microsystems

USA . 1,720 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 815 parts In-Stock

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Corphita

USA . 636 parts In-Stock

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Corohmni

South Africa . 142 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFS5C410NLWFT1G by Onsemi. As a leader in Power Field Effect Transistors (FET), Onsemi delivers top-notch quality and reliability. This N-CHANNEL transistor is designed for a wide range of applications, offering customers unparalleled value and benefits. From its high-performance capabilities to its durable construction, this product is a game-changer in the industry. Trust Onsemi for all your power transistor needs and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and ensures reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower ON resistance and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Maximum Drain-Source On Resistance: 0.0012 ohm

The low ON resistance ensures efficient power transfer and minimal power losses in the circuit, enhancing overall performance.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this FET to withstand elevated temperatures without compromising on performance, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 167 W

The high power dissipation rating indicates the FET's capability to handle high power levels, making it suitable for power applications where heat dissipation is a concern.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C410NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

706 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

330 A

Maximum Drain Current (ID):

330 A

Maximum Drain-Source On Resistance:

.0012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

116 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C410NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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