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NVMFS5C404NT3G

Onsemi

NVMFS5C404NT3G by Onsemi

NVMFS5C404NT3G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0007 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 compliance. Enhances performance in power management systems with its high current handling capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,952 parts In-Stock

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Digiode

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Microchip USA

USA . 3,617 parts In-Stock

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$10.465

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AZTECH Wire

Italy . 258 parts In-Stock

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Component Stockers USA

USA . 775 parts In-Stock

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Kulean Microsystems

USA . 7,558 parts In-Stock

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TANS Electronics

Latvia . 3,064 parts In-Stock

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SupplyDigital Components

Austria . 1,562 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 946 parts In-Stock

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Problanco Electronics

Mexico . 624 parts In-Stock

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Corohmni

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Overview

Experience the power and reliability of the NVMFS5C404NT3G Power Field Effect Transistor by Onsemi. Designed with high-quality materials and advanced technology, this N-channel FET offers exceptional performance in a variety of applications. With a built-in diode and a maximum pulsing drain current of 900A, this transistor provides efficient power management and enhanced functionality. Trust Onsemi's expertise in semiconductor manufacturing to deliver a product that exceeds your expectations. Upgrade your system with the NVMFS5C404NT3G and enjoy seamless operation and lasting durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by having a built-in diode, reducing the need for additional components.

Maximum Pulsed Drain Current (IDM): 900 A

Can handle high current pulses, making it suitable for applications requiring a sudden surge of power.

Maximum Power Dissipation (Abs): 200 W

Can dissipate heat effectively, preventing overheating and ensuring stable performance.

Maximum Operating Temperature: 175 °C

Can operate in high temperature environments without degrading performance, offering versatility in various applications.

Transistor Element Material: SILICON

Silicon is a common material known for its reliability and efficiency in electronic components, ensuring high performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C404NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

907 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

378 A

Maximum Drain Current (ID):

378 A

Maximum Drain-Source On Resistance:

.0007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

120 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C404NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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