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NVMFS5A140PLZWFT3G

Onsemi

NVMFS5A140PLZWFT3G by Onsemi

NVMFS5A140PLZWFT3G by Onsemi is a P-CHANNEL FET with 40V DS Breakdown Voltage and 560A IDM. Ideal for power applications, it features a built-in diode, 140A ID, and 7.2 ohm RDS(on). Suitable for automotive use with AEC-Q101 standard compliance.

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,651 parts In-Stock

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Digiode

USA . 1,806 parts In-Stock

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Nova Conductors

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Aztec Data Supply Inc.

USA . 203 parts In-Stock

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$1.100

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Ampacity Inc.

Singapore . 995 parts In-Stock

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$8.050

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AZTECH Wire

Italy . 631 parts In-Stock

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Semicontronic

India . 408 parts In-Stock

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$31.249

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$31.088

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Component Stockers USA

USA . 643 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,247 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Continental Prestige Electronics

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Kulean Microsystems

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Argo Parts USA

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Corphita

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corohmni

South Africa . 371 parts In-Stock

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UHIMA Technologies

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Overview

Discover the NVMFS5A140PLZWFT3G by Onsemi, a top-tier P-CHANNEL Power FET with a built-in diode that exceeds expectations. Onsemi's reputation for quality and innovation shines through in this product, offering unrivaled performance in various applications. From enhancing power efficiency to ensuring reliability, this FET delivers value and benefits that cater to the needs of customers. Experience the advantages of Onsemi's cutting-edge technology with the NVMFS5A140PLZWFT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, making it suitable for various environmental conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high current-carrying capability, making them efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, enhancing the reliability and safety of the circuit.

Maximum Pulsed Drain Current (IDM): 560 A

With a high pulsed drain current rating, this FET can handle sudden surges of current, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 200 W

The high power dissipation rating ensures the FET can handle high power levels without overheating, maintaining optimal performance.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to operate in demanding conditions without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5A140PLZWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

420 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

140 A

Maximum Drain Current (ID):

140 A

Maximum Drain-Source On Resistance:

7.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

3.8 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

560 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5A140PLZWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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