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NVMFS5885NLWFT3G

Onsemi

NVMFS5885NLWFT3G by Onsemi

NVMFS5885NLWFT3G by Onsemi is a N-CHANNEL FET with 39A max drain current and 54W power dissipation. Ideal for power applications, it operates at up to 175 °C, making it suitable for high-temperature environments. With surface mount configuration, it offers efficient performance in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,915 parts In-Stock

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Digiode

USA . 2,242 parts In-Stock

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AZTECH Wire

Italy . 692 parts In-Stock

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$13.410

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Problanco Electronics

Mexico . 7,278 parts In-Stock

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Kulean Microsystems

USA . 2,418 parts In-Stock

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Corphita

USA . 2,418 parts In-Stock

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TANS Electronics

Latvia . 1,321 parts In-Stock

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UHIMA Technologies

Türkiye . 937 parts In-Stock

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SupplyDigital Components

Austria . 837 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 290 parts In-Stock

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Overview

Enhance your power electronics projects with the NVMFS5885NLWFT3G by Onsemi. With a focus on quality and reliability, Onsemi is a trusted manufacturer in the industry of Power Field Effect Transistors. Ideal for various applications, this N-CHANNEL FET offers a maximum drain current of 39A and a maximum power dissipation of 54W. Its advanced technology ensures efficient performance, while its surface-mount design makes installation a breeze. Experience the value and benefits of Onsemi's innovative products with the NVMFS5885NLWFT3G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL technology provides efficient switching capabilities for power applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and reduces complexity.

Surface Mount: YES

Surface mount capability makes it suitable for compact electronic devices and PCBs.

Maximum Drain Current (Abs) (ID): 39 A

High maximum drain current allows for handling larger power loads.

Maximum Power Dissipation (Abs): 54 W

High power dissipation capability ensures reliable performance under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and performance.

Maximum Operating Temperature: 175 °C

High maximum operating temperature range ensures stability in harsh environments.

Terminal Finish: TIN

TIN finish provides good thermal conductivity and solderability.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature ensures proper soldering without damaging the component.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports reliable soldering process.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5885NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

39 A

Maximum Drain Current (ID):

39 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5885NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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