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NVMFS5832NLWFT1G

Onsemi

NVMFS5832NLWFT1G by Onsemi

NVMFS5832NLWFT1G by Onsemi is a single N-channel Power FET with 120A max drain current and 127W power dissipation. Ideal for high-power applications, it operates at up to 175°C and features metal-oxide semiconductor technology. Suitable for surface mount assembly with matte tin finish, it offers reliable performance in demanding environments.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 6,392 parts In-Stock

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Digiode

USA . 212 parts In-Stock

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Nova Conductors

Japan . 36 parts In-Stock

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AZTECH Wire

Italy . 771 parts In-Stock

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$18.141

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Ampacity Inc.

Singapore . 938 parts In-Stock

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$33.050

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Semicontronic

India . 1,121 parts In-Stock

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$61.050

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$59.524

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$59.218

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Component Connect

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Problanco Electronics

Mexico . 8,010 parts In-Stock

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SupplyDigital Components

Austria . 7,374 parts In-Stock

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Kulean Microsystems

USA . 7,037 parts In-Stock

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Continental Prestige Electronics

USA . 5,563 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,970 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

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Corohmni

South Africa . 329 parts In-Stock

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UHIMA Technologies

Türkiye . 278 parts In-Stock

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Corphita

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Overview

Enhance your power management systems with the NVMFS5832NLWFT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality N-CHANNEL Power FETs like no other. Ideal for a range of applications, this product offers unparalleled performance and reliability. With a high maximum drain current of 120A and a maximum power dissipation of 127W, the NVMFS5832NLWFT1G ensures efficient power handling. Upgrade your systems today and experience the superior benefits and value that Onsemi's FETs provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs, making them a good choice for power applications.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity, making the product easier to use and integrate.

Surface Mount: YES

Surface mount design allows for easy and quick integration onto printed circuit boards, saving space and facilitating mass production.

Maximum Drain Current (Abs) (ID): 120 A

High maximum drain current rating enables the FET to handle large current loads, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 127 W

High power dissipation rating ensures reliable performance under heavy load conditions, reducing the risk of overheating or failure.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making the FET an energy-efficient choice.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance allows the FET to operate in harsh environments without performance degradation, ensuring reliability.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable connection in various operating conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature minimizes the risk of thermal damage during the soldering process, improving reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for efficient soldering processes, ensuring strong and lasting connections between components.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5832NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5832NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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