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NVMFS014P04M8LT1G

Onsemi

NVMFS014P04M8LT1G by Onsemi

NVMFS014P04M8LT1G by Onsemi is a P-CHANNEL FET with 40V DS Breakdown Voltage, 268A IDM, and 0.0138 ohm RDS(ON). Ideal for power management applications in automotive systems due to AEC-Q101 standard compliance.

Median Price

$1.570

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 258 parts In-Stock

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$1.570

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$0.663

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$0.521

10k+ parts

$0.380

258

$1.570

$0.663

$0.521

$0.380

Mouser Electronics

USA . 49 parts In-Stock

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$1.570

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$0.661

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$0.521

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$0.452

49

$1.570

$0.661

$0.521

$0.452

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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Digiode

USA . 1,598 parts In-Stock

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$0.950

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Vyrian

USA . 2,215 parts In-Stock

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NAC Semi

USA . 3,000 parts In-Stock

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$0.473

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$0.473

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Corphita

USA . 232 parts In-Stock

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$0.900

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Corohmni

South Africa . 409 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,220 parts In-Stock

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Problanco Electronics

Mexico . 5,492 parts In-Stock

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TANS Electronics

Latvia . 4,879 parts In-Stock

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Kulean Microsystems

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GreenTree Electronics

Israel . 1,500 parts In-Stock

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UHIMA Technologies

Türkiye . 844 parts In-Stock

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SupplyDigital Components

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Perfect Parts

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Authorized Procurement Solutions

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Overview

Looking for a high-quality Power FET for your next project? Look no further than the NVMFS014P04M8LT1G by Onsemi! With a reputation for excellence in semiconductor manufacturing, Onsemi delivers top-notch products that cater to a wide range of applications. This P-Channel FET offers enhanced performance and reliability, making it an ideal choice for power management solutions. With its built-in diode and efficient design, this transistor provides customers with value, benefits, and advantages that are unmatched in the industry. Upgrade your projects with the NVMFS014P04M8LT1G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs have lower ON-state resistance than N-channel FETs, making them suitable for high efficiency power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect against reverse voltage spikes, enhancing the reliability of the FET in circuit designs.

Maximum Pulsed Drain Current (IDM): 268 A

The high pulsed drain current rating allows the FET to handle large current spikes, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation rating, this FET can handle significant amounts of power without overheating, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature makes this FET suitable for use in a wide range of environments and temperature conditions.

Maximum Feedback Capacitance (Crss): 32 pF

The low feedback capacitance helps to minimize signal distortion and improve high-frequency performance in amplifier circuits.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS014P04M8LT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

133 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

52.1 A

Maximum Drain-Source On Resistance:

.0138 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

32 pF

JESD-30 Code:

R-PDSO-F6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

268 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

NVMFS014P04M8LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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