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NVH050N65S3F

Onsemi

NVH050N65S3F by Onsemi

The Onsemi NVH050N65S3F is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 145A IDM, 830mJ EAS, and 0.05 ohm RDS(ON). With a max power dissipation of 403W and operating temperature range from -55 to 150 °C, it offers reliable performance in various industrial settings.

Median Price

$10.425

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 450 parts In-Stock

1+ parts

$12.850

100+ parts

-

1k+ parts

$7.330

10k+ parts

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450

$12.850

-

$7.330

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DigiKey

USA . 443 parts In-Stock

1+ parts

$12.880

100+ parts

$7.787

1k+ parts

$6.405

10k+ parts

-

443

$12.880

$7.787

$6.405

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Flip Electronics (Authorized)

USA . 7,650 parts In-Stock

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7,650

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Verical

USA . 303 parts In-Stock

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$8.000

1k+ parts

$7.162

10k+ parts

$6.737

303

-

$8.000

$7.162

$6.737

Rochester

USA . 303 parts In-Stock

1+ parts

-

100+ parts

$6.400

1k+ parts

$5.730

10k+ parts

$5.390

303

-

$6.400

$5.730

$5.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,496 parts In-Stock

1+ parts

$13.528

100+ parts

-

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2,496

$13.528

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Flip Electronics

USA . 5,400 parts In-Stock

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5,400

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Vyrian

USA . 3,359 parts In-Stock

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3,359

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Distributors (Availability)

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Corphita

USA . 1,643 parts In-Stock

1+ parts

$12.816

100+ parts

-

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1,643

$12.816

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-

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$14.240

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71

$14.240

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Microchip USA

USA . 9,091 parts In-Stock

1+ parts

$28.892

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9,091

$28.892

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TANS Electronics

Latvia . 8,028 parts In-Stock

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8,028

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Kulean Microsystems

USA . 7,128 parts In-Stock

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7,128

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SupplyDigital Components

Austria . 4,469 parts In-Stock

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4,469

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Problanco Electronics

Mexico . 93 parts In-Stock

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93

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UHIMA Technologies

Türkiye . 32 parts In-Stock

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32

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Overview

Enhance your power systems with the NVH050N65S3F by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL FET offers a wide range of benefits including a high breakdown voltage of 650V and a maximum pulsing drain current of 145A. With its built-in diode and excellent power dissipation capabilities, this transistor is ideal for enhancing efficiency in various electronic systems. Upgrade your projects with the reliability and performance of Onsemi's NVH050N65S3F.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and high performance in various conditions.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows for reliable operation in high voltage applications.

Maximum Pulsed Drain Current (IDM): 145 A

The high pulsed drain current rating enables the FET to handle large currents effectively.

Avalanche Energy Rating (EAS): 830 mJ

The high avalanche energy rating ensures reliable operation in rugged environments.

Maximum Power Dissipation (Abs): 403 W

The high power dissipation rating allows the FET to handle high power applications without overheating.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable performance in a variety of temperature conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVH050N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

830 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

58 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

13 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

145 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVH050N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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