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NVH082N65S3F

Onsemi

NVH082N65S3F by Onsemi

NVH082N65S3F by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It is ideal for SWITCHING applications, offering 100A IDM and 510mJ EAS. Operating in ENHANCEMENT MODE, it has a max power dissipation of 313W and can handle up to 150 °C temperature.

Median Price

$6.810

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 12 parts In-Stock

1+ parts

$4.260

100+ parts

$4.110

1k+ parts

$3.930

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12

$4.260

$4.110

$3.930

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DigiKey

USA . 432 parts In-Stock

1+ parts

$9.360

100+ parts

$5.508

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$4.220

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432

$9.360

$5.508

$4.220

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Distributors (In-Stock)

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Digiode

USA . 1,570 parts In-Stock

1+ parts

$4.161

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1,570

$4.161

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Vyrian

USA . 3,036 parts In-Stock

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3,036

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Flip Electronics

USA . 2,250 parts In-Stock

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2,250

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IBS Electronics

USA . 12 parts In-Stock

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-

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$5.582

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$5.386

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12

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$5.582

$5.386

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 55 parts In-Stock

1+ parts

$3.942

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55

$3.942

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Corohmni

South Africa . 147 parts In-Stock

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$4.800

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147

$4.800

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Microchip USA

USA . 8,328 parts In-Stock

1+ parts

$15.530

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8,328

$15.530

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SupplyDigital Components

Austria . 6,685 parts In-Stock

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Problanco Electronics

Mexico . 4,832 parts In-Stock

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Kulean Microsystems

USA . 4,027 parts In-Stock

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TANS Electronics

Latvia . 313 parts In-Stock

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UHIMA Technologies

Türkiye . 259 parts In-Stock

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Overview

Unleash the power of innovation with the NVH082N65S3F by Onsemi. Crafted with precision and excellence, this N-CHANNEL Power Field Effect Transistor offers unparalleled quality and performance for switching applications. With a high DS Breakdown Voltage of 650V and an impressive Maximum Power Dissipation of 313W, this transistor ensures reliable and efficient operation. From enhancing energy efficiency to optimizing circuit design, the NVH082N65S3F delivers exceptional value and benefits that cater to the diverse needs of customers. Elevate your projects with the trusted reliability and superior technology of Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation properties for the transistor, making it durable and reliable for long-term use.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows the transistor to handle high voltage applications and provides protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 100 A

High pulsed drain current rating allows the transistor to handle large current spikes efficiently, making it suitable for high power applications.

Maximum Power Dissipation (Abs): 313 W

High power dissipation rating ensures the transistor can handle high power loads without overheating, making it reliable for demanding applications.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows the transistor to function effectively in various environmental conditions, increasing its versatility.

Technical Specifications

Power Field Effect Transistors (FET) NVH082N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

510 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVH082N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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