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NVH040N65S3F

Onsemi

NVH040N65S3F by Onsemi

NVH040N65S3F by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 162.5A IDM and 0.04ohm RDS(ON), operating in ENHANCEMENT MODE at temperatures from -55 to 150 °C. Suitable for high-power applications requiring reliable performance.

Median Price

$13.901

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 412 parts In-Stock

1+ parts

$16.640

100+ parts

$10.285

1k+ parts

$8.921

10k+ parts

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412

$16.640

$10.285

$8.921

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Chip1Stop

Japan . 165 parts In-Stock

1+ parts

$49.700

100+ parts

$23.500

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$49.700

$23.500

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Verical

USA . 53 parts In-Stock

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-

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$11.162

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$9.988

10k+ parts

$9.400

53

-

$11.162

$9.988

$9.400

Rochester

USA . 53 parts In-Stock

1+ parts

-

100+ parts

$8.930

1k+ parts

$7.990

10k+ parts

$7.520

53

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$8.930

$7.990

$7.520

Distributors (In-Stock)

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Digiode

USA . 543 parts In-Stock

1+ parts

$14.383

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543

$14.383

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Vyrian

USA . 8,659 parts In-Stock

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8,659

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Flip Electronics

USA . 5,400 parts In-Stock

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5,400

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Distributors (Availability)

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Corphita

USA . 325 parts In-Stock

1+ parts

$13.626

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-

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325

$13.626

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Corohmni

South Africa . 373 parts In-Stock

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$15.140

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373

$15.140

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Microchip USA

USA . 4,377 parts In-Stock

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$30.712

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4,377

$30.712

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SupplyDigital Components

Austria . 7,721 parts In-Stock

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Kulean Microsystems

USA . 7,248 parts In-Stock

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Problanco Electronics

Mexico . 3,142 parts In-Stock

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Perfect Parts

USA . 1,434 parts In-Stock

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TANS Electronics

Latvia . 1,087 parts In-Stock

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UHIMA Technologies

Türkiye . 716 parts In-Stock

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GreenTree Electronics

Israel . 295 parts In-Stock

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Authorized Procurement Solutions

USA . 240 parts In-Stock

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Overview

Upgrade your power systems with the NVH040N65S3F by Onsemi. Crafted with precision and expertise, this N-channel power field-effect transistor offers unparalleled performance and reliability for your switching applications. With a maximum pulsed drain current of 162.5 A and a minimum DS breakdown voltage of 650 V, this transistor ensures optimal efficiency and durability. Whether you're in the automotive industry or industrial sector, the NVH040N65S3F delivers the power and quality you need to elevate your projects to the next level. Trust in Onsemi's legacy of innovation and experience, and experience the difference with this exceptional transistor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the FET suitable for various applications in different operating environments.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON-state resistance and higher efficiency compared to P-CHANNEL FETs, making them a better choice for many power applications.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows the FET to handle high power applications and voltages without risk of failure, ensuring reliable performance.

Maximum Pulsed Drain Current (IDM): 162.5 A

The high pulsed drain current rating allows the FET to handle short-duration peak currents, making it suitable for high-power switching applications.

Maximum Power Dissipation (Abs): 446 W

High power dissipation capability ensures that the FET can handle significant power levels without overheating, increasing its reliability and longevity.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to operate in demanding conditions without performance degradation, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NVH040N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1009 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

162.5 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVH040N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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