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NUD3112DMT1

Onsemi

NUD3112DMT1 by Onsemi

NUD3112DMT1 by Onsemi is a peripheral driver with 2 functions, built-in transient protection, and can handle up to 0.5A output current. It is designed for industrial applications requiring a 12V nominal voltage and operates in temperatures ranging from -40°C to 85°C. The package style is small outline with gull wing terminals, making it suitable for surface mount installations.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 877 parts In-Stock

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$8.443

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Ampacity Inc.

Singapore . 698 parts In-Stock

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$39.500

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SupplyDigital Components

Austria . 5,842 parts In-Stock

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Argo Parts USA

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Problanco Electronics

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Kulean Microsystems

USA . 1,599 parts In-Stock

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Continental Prestige Electronics

USA . 1,567 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 865 parts In-Stock

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TANS Electronics

Latvia . 743 parts In-Stock

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Vigor

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Microchip USA

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Overview

Experience the cutting-edge technology of the NUD3112DMT1 by Onsemi, a top-tier manufacturer known for delivering high-quality peripheral drivers. This versatile product offers built-in transient protection and is designed to enhance the performance of various applications. With its compact design and industrial-grade temperature range, this peripheral driver ensures reliable operation in diverse environments. Trust Onsemi to provide innovative solutions that exceed your expectations and elevate your projects to new heights. Elevate your electronics with the NUD3112DMT1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications or long-term use.

Surface Mount: YES

With surface mount capability, the product is easy to install and saves space on the PCB.

No. of Functions: 2

Having 2 functions in one device increases efficiency and reduces the need for multiple drivers, saving cost and board space.

Built-in Protections: TRANSIENT

The built-in transient protection ensures the safety of connected components during voltage spikes or surges, increasing reliability.

Maximum Output Current: 0.5 A

With a maximum output current of 0.5A, the peripheral driver can handle moderate loads, making it suitable for various applications.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12V makes this peripheral driver compatible with common power sources, simplifying integration.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type allows for versatile use in different circuit designs, offering flexibility in functionality.

Technical Specifications

Peripheral Drivers NUD3112DMT1 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NUD3112DMT1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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