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NUD3112LT1

Onsemi

NUD3112LT1 by Onsemi

NUD3112LT1 by Onsemi is a small outline, thin profile peripheral driver with built-in transient protection. It operates in industrial temperature range (-40 to 85°C) and has a max output current of 0.5A. Ideal for applications requiring sink output current flow direction at 12V nominal voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 28,140 parts In-Stock

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R&J Components

USA . 9,000 parts In-Stock

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Vyrian

USA . 5,714 parts In-Stock

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Digiode

USA . 1,318 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$3.843

100+ parts

$3.497

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$3.151

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600

$3.843

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$3.151

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Aztec Data Supply Inc.

USA . 3,785 parts In-Stock

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$4.110

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AZTECH Wire

Italy . 670 parts In-Stock

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$12.204

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Ampacity Inc.

Singapore . 1,148 parts In-Stock

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$30.500

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Lixinc

USA . 11,920 parts In-Stock

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Problanco Electronics

Mexico . 8,142 parts In-Stock

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Kulean Microsystems

USA . 6,579 parts In-Stock

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Argo Parts USA

USA . 4,485 parts In-Stock

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Continental Prestige Electronics

USA . 4,051 parts In-Stock

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TANS Electronics

Latvia . 2,290 parts In-Stock

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Corphita

USA . 2,007 parts In-Stock

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SupplyDigital Components

Austria . 1,856 parts In-Stock

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UHIMA Technologies

Türkiye . 522 parts In-Stock

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Corohmni

South Africa . 371 parts In-Stock

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Microchip USA

USA . 312 parts In-Stock

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Vigor

Singapore . 250 parts In-Stock

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Bastille Electronics

Australia . 16 parts In-Stock

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Overview

Experience the top-notch quality and reliability of Onsemi with the NUD3112LT1 peripheral driver. Perfect for a wide range of applications, this product offers exceptional value and benefits to customers. With built-in transient protections and a compact design, the NUD3112LT1 ensures optimal performance in industrial settings. Trust Onsemi to deliver cutting-edge solutions that meet your needs. Elevate your projects with the NUD3112LT1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity and reliability.

Built-in Protections: TRANSIENT

Offers protection against transient voltage spikes, enhancing the safety of connected devices.

Maximum Output Current: 0.5 A

Capable of delivering a decent amount of current, making it suitable for a variety of peripheral devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring stable performance under varying temperature conditions.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface IC type that can work with different types of peripherals, offering flexibility in usage.

Technical Specifications

Peripheral Drivers NUD3112LT1 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.3 mm

Trade Compliance

NUD3112LT1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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