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NUD3160DMT1

Onsemi

NUD3160DMT1 by Onsemi

NUD3160DMT1 by Onsemi is a peripheral driver with 2 functions, operating at -40 to 125 °C. It has a max supply voltage of 60 V and output current of 0.15 A, suitable for automotive applications. The package style is small outline, thin profile, shrink pitch with gull wing terminals in a rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 600,000 parts In-Stock

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Chip Stock

USA . 64,830 parts In-Stock

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Vyrian

USA . 8,101 parts In-Stock

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Digiode

USA . 1,548 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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AZTECH Wire

Italy . 636 parts In-Stock

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$6.692

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636

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Ampacity Inc.

Singapore . 1,259 parts In-Stock

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$34.500

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SupplyDigital Components

Austria . 6,289 parts In-Stock

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Corphita

USA . 2,279 parts In-Stock

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Problanco Electronics

Mexico . 1,311 parts In-Stock

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TANS Electronics

Latvia . 1,088 parts In-Stock

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Microchip USA

USA . 491 parts In-Stock

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Kulean Microsystems

USA . 253 parts In-Stock

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Corohmni

South Africa . 197 parts In-Stock

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Vigor

Singapore . 171 parts In-Stock

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UHIMA Technologies

Türkiye . 65 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of high-quality peripheral drivers with the NUD3160DMT1 by Onsemi. Trusted for its reliability and precision, Onsemi delivers top-notch products that exceed expectations. Perfect for a range of applications, this driver offers seamless integration with built-in transient protections. Experience the value and benefits firsthand with the NUD3160DMT1, providing customers with unrivaled performance and peace of mind. Elevate your projects with this versatile and efficient solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Maximum Supply Voltage: 60 V

Can handle high voltage inputs, providing versatility in usage.

Built-in Protections: TRANSIENT

Offers protection against voltage transients, ensuring safety and reliability.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range and performance.

Output Current Flow Direction: SINK

Sink current capability allows for control of multiple output devices in a circuit.

Technical Specifications

Peripheral Drivers NUD3160DMT1 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

60 V

Minimum Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NUD3160DMT1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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