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NUD3160LT1

Onsemi

NUD3160LT1 by Onsemi

NUD3160LT1 by Onsemi is a peripheral driver with a max supply voltage of 60V and built-in transient protection. It has a small outline, thin profile package style and operates in automotive temperature grades. This buffer or inverter-based driver can handle an output current of 0.15A and is suitable for sink applications in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 606 parts In-Stock

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606

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Digiode

USA . 595 parts In-Stock

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595

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Semi Source

USA . 365 parts In-Stock

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Nova Conductors

Japan . 83 parts In-Stock

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AZTECH Wire

Italy . 756 parts In-Stock

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$14.802

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756

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$16.854

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$15.337

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$13.820

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500

$16.854

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$13.820

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Ampacity Inc.

Singapore . 920 parts In-Stock

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$42.500

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920

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TANS Electronics

Latvia . 3,991 parts In-Stock

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SupplyDigital Components

Austria . 3,910 parts In-Stock

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Kulean Microsystems

USA . 2,103 parts In-Stock

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Problanco Electronics

Mexico . 1,313 parts In-Stock

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Corphita

USA . 642 parts In-Stock

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UHIMA Technologies

Türkiye . 512 parts In-Stock

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512

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Bastille Electronics

Australia . 300 parts In-Stock

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Vigor

Singapore . 250 parts In-Stock

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Microchip USA

USA . 233 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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Overview

Enhance your automotive electronics with the NUD3160LT1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality peripheral drivers that guarantee high performance and reliability. This small outline, thin profile package boasts built-in transient protections, making it ideal for a wide range of applications. With a maximum supply voltage of 60V and an output current of 0.15A, this peripheral driver offers exceptional value and benefits to customers looking for a trustworthy solution for their electronic needs. Choose Onsemi for cutting-edge technology and superior innovation in automotive electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation, saving time and effort during assembly.

Maximum Supply Voltage: 60 V

Provides a wide range of voltage compatibility, making it versatile for different power sources.

Package Shape: RECTANGULAR

Allows for a compact design, saving space in electronic devices.

Built-in Protections: TRANSIENT

Ensures the safety of connected devices by offering protection against voltage spikes and surges.

No. of Terminals: 3

Provides enough connection points for basic peripheral driver setups.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Offers a sleek and space-saving design for efficient PCB layout.

Minimum Supply Voltage: 12 V

Works well with lower voltage systems, increasing compatibility with a wider range of devices.

Maximum Operating Temperature: 125 °C

Ensures the peripheral driver can function effectively in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold conditions, expanding its usability in various settings.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Allows for flexibility in PCB layout and installation options.

Maximum Seated Height: 1.11 mm

Low-profile design enables the peripheral driver to fit in tight spaces.

Width: 1.3 mm

Compact width allows for efficient use of space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 235

Withstands high-temperature reflow processes without damage.

Length: 2.9 mm

Compact length contributes to a space-saving design.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where reliability under extreme conditions is crucial.

Maximum Output Current: 0.15 A

Provides sufficient current for driving peripherals in various electronic systems.

Terminal Form: GULL WING

Allows for easy soldering and secure attachment to the PCB.

Terminal Pitch: 0.95 mm

Offers a standard pitch for compatibility with a wide range of PCB layouts.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Supports different interface requirements for various peripherals.

Output Current Flow Direction: SINK

Suitable for applications where sinking current is needed to control connected devices.

Technical Specifications

Peripheral Drivers NUD3160LT1 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

60 V

Minimum Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.3 mm

Trade Compliance

NUD3160LT1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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