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NTTFS5CS70NLTWG

Onsemi

NTTFS5CS70NLTWG by Onsemi

NTTFS5CS70NLTWG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 16A ID, and 0.0091 ohm RDS(ON). Ideal for applications requiring high power dissipation in small outline packages. Operating from -55 to 175 °C, it suits various enhancement mode circuit designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,694 parts In-Stock

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Digiode

USA . 833 parts In-Stock

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Advanced Electronics

New Zealand . 4,794 parts In-Stock

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$2.200

100+ parts

$2.178

1k+ parts

$2.090

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4,794

$2.200

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$2.090

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Component Stockers USA

USA . 3,290 parts In-Stock

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$8.200

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AZTECH Wire

Italy . 976 parts In-Stock

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$21.290

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SupplyDigital Components

Austria . 7,338 parts In-Stock

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Problanco Electronics

Mexico . 6,355 parts In-Stock

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TANS Electronics

Latvia . 4,291 parts In-Stock

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Kulean Microsystems

USA . 2,854 parts In-Stock

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Corphita

USA . 2,137 parts In-Stock

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UHIMA Technologies

Türkiye . 938 parts In-Stock

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Corohmni

South Africa . 467 parts In-Stock

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Overview

Elevate your power management solutions with the NTTFS5CS70NLTWG by Onsemi. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability, thanks to Onsemi's trusted manufacturing process. Ideal for a range of applications, this N-channel transistor with a built-in diode is designed for enhanced efficiency and durability. Say goodbye to power fluctuations and hello to seamless operation with the NTTFS5CS70NLTWG. Experience the value, benefits, and advantages that only Onsemi can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer high efficiency and low ON resistance, providing better performance in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage spikes.

Surface Mount: YES

Surface mount capability allows for easy and convenient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures reliable operation even in high voltage applications.

Maximum Pulsed Drain Current (IDM): 440 A

The high pulsed drain current rating enables the FET to handle momentary high-current pulses without damage.

Maximum Power Dissipation (Abs): 63 W

The high power dissipation rating allows the FET to handle high power levels without overheating.

Maximum Operating Temperature: 175 °C

The wide operating temperature range makes the FET suitable for use in various environments and conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS5CS70NLTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

166 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.0091 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

15 pF

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

440 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NTTFS5CS70NLTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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