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NTTFS4821NTAG

Onsemi

NTTFS4821NTAG by Onsemi

NTTFS4821NTAG by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 30V DS Breakdown Voltage, 171A Pulsed Drain Current, and 0.0108 ohm Drain-Source On Resistance. This MOSFET operates in ENHANCEMENT MODE and has a max power dissipation of 38.5W, making it ideal for high-power switching circuits.

Median Price

$0.887

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

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DigiKey

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Mouser Electronics

USA . 1 parts In-Stock

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$0.294

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Flip Electronics

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Prism Electronics

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Corohmni

South Africa . 484 parts In-Stock

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Component Stockers USA

USA . 792 parts In-Stock

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$99.990

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Perfect Parts

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SupplyDigital Components

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Kulean Microsystems

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Lixinc

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Overview

Elevate your power management solutions with the NTTFS4821NTAG by Onsemi. Crafted with precision and expertise, this Power FET boasts a single configuration with a built-in diode, perfect for switching applications. Its N-CHANNEL polarity ensures reliable performance, while its small outline package design makes it ideal for surface mounting. With a maximum drain current of 57A and an operating temperature of 150°C, this transistor delivers exceptional power dissipation of 38.5W. Say goodbye to overheating and hello to efficiency with the NTTFS4821NTAG - the ultimate choice for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable and long-lasting.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of current in the designated direction, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and offers added functionality with the integrated diode.

Transistor Application: SWITCHING

Ideal for applications requiring fast switching speeds and low power consumption.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 30 V

Ensures reliable operation under high voltage conditions, enhancing safety and performance.

Package Shape: SQUARE

Provides a compact and efficient form factor, suitable for various electronic devices and applications.

Terminal Form: NO LEAD

Reduces the risk of lead contamination and simplifies the manufacturing process.

Operating Mode: ENHANCEMENT MODE

Allows for precise control of the transistor's conductivity, enhancing efficiency and performance.

Maximum Pulsed Drain Current (IDM): 171 A

Supports high current applications, making it suitable for demanding tasks.

Avalanche Energy Rating (EAS): 55 mJ

Provides protection against voltage spikes and surges, improving overall reliability.

Maximum Drain Current (Abs) (ID): 57 A

Can handle high levels of continuous current, ensuring stable operation under heavy loads.

No. of Terminals: 5

Offers flexibility in circuit connections and allows for versatile usage in different configurations.

Maximum Power Dissipation (Abs): 38.5 W

Can dissipate heat efficiently, preventing overheating and ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

Saves space on PCBs and enables compact device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high switching speeds and low power consumption, enhancing overall performance.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance.

Transistor Element Material: SILICON

Offers high reliability and consistent performance over a wide range of operating conditions.

Terminal Finish: MATTE TIN

Provides good solderability and conductivity for reliable connections.

Maximum Drain Current (ID): 13.5 A

Suitable for a wide range of applications requiring moderate current handling capability.

Maximum Drain-Source On Resistance: 0.0108 ohm

Minimizes power loss and improves efficiency during operation.

Terminal Position: DUAL

Allows for versatile mounting options and ease of connection in different circuit configurations.

Case Connection: DRAIN

Facilitates easy integration into the circuit and efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow process during manufacturing, leading to reliable connections.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow processes during assembly without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS4821NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

55 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

57 A

Maximum Drain Current (ID):

13.5 A

Maximum Drain-Source On Resistance:

.0108 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

171 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4821NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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