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NTR4501NT1

Onsemi

NTR4501NT1 by Onsemi

NTR4501NT1 by Onsemi is a power FET with N-channel configuration and built-in diode, ideal for switching applications. It features a max drain current of 3.2A, operating in enhancement mode with a max power dissipation of 1.25W. With a small outline package style and peak reflow temperature of 235 °C, it offers efficient performance in various electronic devices.

Median Price

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Lifecycle Status

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9

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1k+

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Chip Stock

USA . 266,500 parts In-Stock

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Vyrian

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Bristol Electronics

USA . 4,486 parts In-Stock

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Dan-Mar Components

USA . 4,486 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,013 parts In-Stock

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Digiode

USA . 432 parts In-Stock

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Classic Components Corporation

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Semi Source

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Sinequanon

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AZTECH Wire

Italy . 736 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,057 parts In-Stock

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TANS Electronics

Latvia . 8,153 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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Austria . 3,975 parts In-Stock

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Corphita

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 800 parts In-Stock

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Metaverse IC Inc.

Canada . 550 parts In-Stock

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Futuretech Components

Singapore . 504 parts In-Stock

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Overview

Enhance your power management solutions with the NTR4501NT1 by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a single configuration and built-in diode, this transistor ensures seamless operation and efficiency. Its small outline package shape and gull wing terminal form make it perfect for surface mount applications. Experience the benefits of enhanced power dissipation and maximum drain current, providing value and reliability to your projects. Trust Onsemi for quality components that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and better performance compared to P-channel FETs, making this product a better choice for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for simpler circuit designs and provides reverse polarity protection, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and high efficiency, making it ideal for power management systems.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into compact PCB designs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltages without risk of damage, providing a level of reliability for various applications.

Maximum Drain Current (ID): 3.2 A

The high maximum drain current capacity allows this FET to handle power loads efficiently, making it suitable for high-current applications.

Maximum Power Dissipation (Abs): 1.25 W

With a maximum power dissipation of 1.25W, this FET can handle heat dissipation effectively, ensuring reliable operation even under high-power conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures the FET can operate reliably in harsh environmental conditions without thermal shutdown.

Maximum Drain-Source On Resistance: 0.08 ohm

With a low drain-source ON resistance, this FET minimizes power losses and heat generation, improving overall efficiency in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) NTR4501NT1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4501NT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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