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NTR4501NST1G

Onsemi

NTR4501NST1G by Onsemi

NTR4501NST1G by Onsemi is a single N-channel FET with built-in diode for switching applications. It features a max drain current of 3.2A, min DS breakdown voltage of 20V, and max power dissipation of 1.25W. With a small outline package style and operating temperature up to 150 °C, it is ideal for high-performance electronic devices requiring fast turn-on/off times.

Median Price

$0.121

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 6,000 parts In-Stock

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-

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$0.142

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$0.118

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$0.105

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$0.105

DigiKey

USA . 6,000 parts In-Stock

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$0.100

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$0.100

Flip Electronics (Authorized)

USA . 6,000 parts In-Stock

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Vyrian

USA . 1,525 parts In-Stock

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Digiode

USA . 1,842 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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Corohmni

South Africa . 446 parts In-Stock

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446

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Corphita

USA . 2,184 parts In-Stock

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$0.104

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Kepictronics

USA . 27,000 parts In-Stock

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Problanco Electronics

Mexico . 8,364 parts In-Stock

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TANS Electronics

Latvia . 7,644 parts In-Stock

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Kulean Microsystems

USA . 3,537 parts In-Stock

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SupplyDigital Components

Austria . 1,743 parts In-Stock

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UHIMA Technologies

Türkiye . 947 parts In-Stock

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Overview

Enhance your power management capabilities with the NTR4501NST1G by Onsemi. This high-quality Power Field Effect Transistor (FET) offers unmatched efficiency and reliability, thanks to Onsemi's reputation for superior manufacturing. Ideal for switching applications, this N-channel transistor provides seamless operation in a compact package. With a built-in diode and enhanced mode configuration, this transistor delivers maximum performance with minimal power dissipation. Experience the value and benefits of the NTR4501NST1G in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body ensures durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer fast switching speeds and low ON resistance, making them suitable for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode can provide reverse polarity protection and simplify circuit design in power switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET delivers efficient performance in controlling power flow.

Surface Mount: YES

The surface mount capability ensures easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20 V, this FET can handle moderate to high voltage applications effectively.

Maximum Pulsed Drain Current (IDM): 10 A

The high maximum pulsed drain current of 10 A allows for handling short-term peak loads efficiently in switching operations.

Maximum Drain Current (Abs) (ID): 3.2 A

The maximum drain current capability of 3.2 A ensures reliable performance under continuous load conditions.

Maximum Power Dissipation (Abs): 1.25 W

With a maximum power dissipation of 1.25 W, this FET can effectively dissipate heat generated during operation, enhancing its reliability.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures stable performance and reliability even in demanding environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTR4501NST1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.084 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

65 pF

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

19.5 ns

Maximum Turn On Time (ton):

24.1 ns

Trade Compliance

NTR4501NST1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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