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NTR4501NT3G

Onsemi

NTR4501NT3G by Onsemi

NTR4501NT3G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 20V DS Breakdown Voltage, 10A Max Pulsed Drain Current, and 0.08 ohm Max Drain-Source Resistance. Ideal for use in small outline packages where high power dissipation and low on-resistance are required.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 233,500 parts In-Stock

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Vyrian

USA . 11,284 parts In-Stock

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Digiode

USA . 1,467 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$2.276

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$2.071

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$1.866

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AZTECH Wire

Italy . 101 parts In-Stock

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$17.790

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Component Stockers USA

USA . 330 parts In-Stock

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$99.990

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Kepictronics

USA . 42,000 parts In-Stock

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SupplyDigital Components

Austria . 5,046 parts In-Stock

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TANS Electronics

Latvia . 4,113 parts In-Stock

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Problanco Electronics

Mexico . 3,403 parts In-Stock

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Kulean Microsystems

USA . 3,327 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Corohmni

South Africa . 300 parts In-Stock

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Overview

Discover the power and efficiency of the NTR4501NT3G by Onsemi, a high-quality Power Field Effect Transistor (FET) with a single configuration and built-in diode. Ideal for switching applications, this N-CHANNEL transistor offers exceptional performance and reliability. With a maximum pulsing drain current of 10A and a minimum DS breakdown voltage of 20V, this transistor is designed to meet your power needs with ease. Experience the value and benefits that Onsemi brings to the table with this cutting-edge technology, providing customers with top-notch quality and superior functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the Power FET lightweight and durable, ideal for portable applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher current-carrying capacity compared to P-channel FETs, making them suitable for high-power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance and reliability in power control circuits.

Maximum Drain-Source On Resistance: 0.08 ohm

With a low on-resistance, this Power FET minimizes power loss and heat generation, making it energy-efficient and suitable for high-frequency switching applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the transistor operation and are commonly used in digital circuits for efficient switching.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this Power FET can withstand elevated temperatures and operate reliably in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NTR4501NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4501NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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