Loading...

NTR4501NT3

Onsemi

NTR4501NT3 by Onsemi

NTR4501NT3 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 20V DS Breakdown Voltage, 10A Max Pulsed Drain Current, and 0.08 ohm Max Drain-Source Resistance. This SMALL OUTLINE transistor operates in ENHANCEMENT MODE at up to 150 °C, making it ideal for various power management tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,404

-

-

-

-

Digiode

USA . 486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

486

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$16.240

100+ parts

-

1k+ parts

-

10k+ parts

-

591

$16.240

-

-

-

Kulean Microsystems

USA . 7,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,201

-

-

-

-

Problanco Electronics

Mexico . 7,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,164

-

-

-

-

SupplyDigital Components

Austria . 6,819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,819

-

-

-

-

TANS Electronics

Latvia . 5,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,622

-

-

-

-

Corphita

USA . 1,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,473

-

-

-

-

UHIMA Technologies

Türkiye . 913 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

913

-

-

-

-

Corohmni

South Africa . 478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

478

-

-

-

-

Overview

Unleash the power of innovation with the NTR4501NT3 by Onsemi, a top-tier manufacturer known for excellence in Power Field Effect Transistors (FET). Perfect for switching applications, this N-channel transistor offers superior performance and reliability with its single configuration featuring a built-in diode. With a maximum pulsated drain current of 10A and a minimum DS breakdown voltage of 20V, this FET delivers unmatched efficiency and durability. Ideal for a variety of electronic devices, the NTR4501NT3 is the ultimate solution for your power management needs. Elevate your projects with the quality and value that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for various applications in a compact form factor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in power switching applications, providing efficient and fast operation for better overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, enhancing the reliability and efficiency of the switching operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance, making it suitable for high-frequency and high-efficiency power control.

Surface Mount: YES

Being surface mountable, this FET is easier to handle during assembly and enables compact circuit designs for space-constrained applications.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20 V, this FET can handle medium power applications with ease, ensuring reliable operation within the specified voltage range.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement on circuit boards and efficient heat dissipation, contributing to better thermal performance.

Terminal Form: GULL WING

The gull wing terminals provide secure connections and facilitate easier soldering during assembly, ensuring reliable electrical contact for efficient power transmission.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode means that the FET can be easily turned on and off, offering greater control over power management and reducing power losses during operation.

Maximum Pulsed Drain Current (IDM): 10 A

The high pulsed drain current rating of 10 A allows this FET to handle short-duration overloads effectively, making it suitable for demanding applications that require high current capabilities.

Maximum Drain Current (Abs) (ID): 3.2 A

With a maximum drain current rating of 3.2 A, this FET can efficiently handle moderate power loads, ensuring stable and reliable performance in various switching applications.

No. of Terminals: 3

Having three terminals enables easy connection to external circuitry, simplifying the overall integration of the FET into the system for enhanced functionality.

Maximum Power Dissipation (Abs): 1.25 W

The maximum power dissipation rating of 1.25 W ensures that the FET can operate within its specified power limits without overheating, contributing to long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for efficient heat dissipation, making it suitable for compact applications with limited available space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology ensures high efficiency, low on-resistance, and fast switching speeds, making this FET ideal for power control and management.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments, ensuring reliable performance in harsh operating conditions.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its high conductivity and reliability, making it ideal for power switching applications where performance and durability are crucial.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability and electrical conductivity, facilitating easy assembly and robust connections for reliable power transmission.

Maximum Drain-Source On Resistance: 0.08 ohm

The low drain-source on resistance of 0.08 ohm minimizes power losses and improves efficiency during switching operations, making this FET an excellent choice for power control applications.

Terminal Position: DUAL

Having dual terminal positions allows for versatile mounting options and flexible circuit layouts, enhancing the applicability and ease of integration of this FET in various systems.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235 °C, this FET can withstand high-temperature soldering processes without compromising its performance or reliability, ensuring ease of assembly and robust connections.

Technical Specifications

Power Field Effect Transistors (FET) NTR4501NT3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4501NT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5