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NTR3162PT1G

Onsemi

NTR3162PT1G by Onsemi

NTR3162PT1G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features 2.2A Drain Current, 0.07 ohm On Resistance, and operates in ENHANCEMENT MODE. With a max power dissipation of 1.25W and operating temperature up to 150 °C, it is suitable for various electronic designs requiring high performance in a small outline package.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 73,000 parts In-Stock

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Vyrian

USA . 11,625 parts In-Stock

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Digiode

USA . 1,065 parts In-Stock

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Semi Source

USA . 145 parts In-Stock

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AZTECH Wire

Italy . 470 parts In-Stock

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$17.260

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470

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Kepictronics

USA . 306,000 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Problanco Electronics

Mexico . 5,032 parts In-Stock

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Kulean Microsystems

USA . 2,631 parts In-Stock

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Corphita

USA . 2,467 parts In-Stock

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TANS Electronics

Latvia . 1,781 parts In-Stock

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UHIMA Technologies

Türkiye . 932 parts In-Stock

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SupplyDigital Components

Austria . 627 parts In-Stock

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Overview

Experience unparalleled quality and performance with the NTR3162PT1G by Onsemi, a leading manufacturer in the industry. This P-CHANNEL FET offers exceptional value and benefits for various switching applications. Its built-in diode and enhancement mode operation ensure smooth functionality while its small outline package and gull wing terminals make it easy to integrate into your designs. Trust Onsemi's expertise and innovation to elevate your projects to new heights with the NTR3162PT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good thermal and electrical insulation, ensuring reliable performance and durability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are commonly used for low-power applications, making this transistor suitable for various switching circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against voltage spikes, improving overall efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast response times and low power consumption.

Surface Mount: YES

With surface mount capability, this transistor is easily integrated onto PCBs, saving space and making assembly more efficient.

Minimum DS Breakdown Voltage: 20 V

The high breakdown voltage ensures reliable operation in various voltage conditions, making it suitable for a wide range of applications.

Maximum Drain Current (Abs): 2.2 A

The high drain current rating allows for handling larger loads, making this transistor versatile for different circuit requirements.

Maximum Power Dissipation (Abs): 1.25 W

With a high power dissipation capability, this transistor can handle heat effectively, ensuring long-term reliability.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for reliable performance in various environmental conditions, enhancing the transistor's versatility.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR3162PT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.2 A

Maximum Drain Current (ID):

2.2 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR3162PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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