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NTR3162PT3G

Onsemi

NTR3162PT3G by Onsemi

NTR3162PT3G by Onsemi is a P-CHANNEL FET with 20V DS breakdown voltage, ideal for switching applications. It features a max drain current of 2.2A and 0.07 ohm on-resistance, operating in enhancement mode at up to 150 °C. This small outline transistor with gull wing terminals is designed for high power dissipation of 1.25W in surface mount configurations.

Median Price

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3

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1k+

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Chip Stock

USA . 71,000 parts In-Stock

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Vyrian

USA . 10,743 parts In-Stock

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Digiode

USA . 2,290 parts In-Stock

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AZTECH Wire

Italy . 197 parts In-Stock

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$16.230

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Metaverse IC Inc.

Canada . 125,880 parts In-Stock

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Kepictronics

USA . 45,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,950 parts In-Stock

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TANS Electronics

Latvia . 6,830 parts In-Stock

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SupplyDigital Components

Austria . 4,804 parts In-Stock

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Kulean Microsystems

USA . 4,690 parts In-Stock

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Problanco Electronics

Mexico . 1,647 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 451 parts In-Stock

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Corohmni

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Overview

Discover the NTR3162PT3G by Onsemi, a high-quality P-Channel Field Effect Transistor with a built-in diode. This versatile component is perfect for various switching applications, offering reliable performance and efficiency. With a maximum power dissipation of 1.25W and a low drain-source on resistance of 0.07 ohm, this transistor provides great value to customers looking for a compact and efficient solution. Trust in Onsemi's expertise in semiconductor technology and elevate your projects with the NTR3162PT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the transistor lightweight and durable, making it suitable for portable applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low power consumption and high input impedance, making them ideal for low voltage applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space on the PCB, making it more cost-effective for certain applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency.

Surface Mount: YES

Surface mount installation allows for easy and compact integration onto PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can withstand higher voltages, making it suitable for a variety of applications.

Maximum Drain Current (Abs): 2.2 A

The high maximum drain current rating allows for handling higher current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 1.25 W

The high power dissipation rating ensures that the transistor can handle heat dissipation effectively, improving overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high input impedance, low power consumption, and fast switching speeds, making it a reliable choice for various applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range of 150 °C, this transistor can withstand elevated temperatures, making it suitable for harsh environments.

Terminal Finish: Matte Tin (Sn)

The matte tin finish ensures good solderability and corrosion resistance, enhancing the reliability and longevity of the connections.

Maximum Drain-Source On Resistance: 0.07 ohm

The low drain-source on-resistance minimizes power loss and heat generation, improving efficiency in power switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR3162PT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.2 A

Maximum Drain Current (ID):

2.2 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR3162PT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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