Loading...

NTQD4154ZR2

Onsemi

NTQD4154ZR2 by Onsemi

NTQD4154ZR2 by Onsemi is a N-CHANNEL FET with 20V DS breakdown voltage, 0.019 ohm RDS(on), and 30A IDM. Commonly used for switching applications, it features a common drain configuration with built-in diode and resistor elements. This MOSFET is surface mountable in a small outline package ideal for enhancement mode operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

570

-

-

-

-

Digiode

USA . 69 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

69

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 8,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,129

-

-

-

-

Problanco Electronics

Mexico . 7,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,049

-

-

-

-

TANS Electronics

Latvia . 5,963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,963

-

-

-

-

Kulean Microsystems

USA . 4,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,960

-

-

-

-

Corphita

USA . 802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

802

-

-

-

-

UHIMA Technologies

Türkiye . 516 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

516

-

-

-

-

Corohmni

South Africa . 221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

221

-

-

-

-

Overview

Experience the power of innovation with the NTQD4154ZR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed for optimal performance and reliability. This N-CHANNEL transistor features a common drain configuration with built-in diode and resistor, making it ideal for switching applications. With a maximum pulsed drain current of 30A and a minimum DS breakdown voltage of 20V, this small outline package offers outstanding value and benefits to customers looking for enhanced efficiency and durability in their electronic devices. Choose Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and durable, ideal for use in various electronic applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher electron mobility, making them more efficient for switching applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and provide added protection, making this transistor convenient and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency.

Surface Mount: YES

Being surface mountable allows for easy and compact integration into PCB designs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle relatively high voltages, suitable for a wide range of applications.

Maximum Drain Current (ID): 7.5 A

The high maximum drain current rating of 7.5A enables the transistor to handle heavy loads without overheating or performance degradation.

Maximum Pulsed Drain Current (IDM): 30 A

The high pulsed drain current capability of 30A allows for momentary peak loads to be handled effectively, ensuring reliable operation under varying conditions.

Maximum Drain-Source On Resistance: 0.019 ohm

The low drain-source on resistance of 0.019 ohms reduces power loss and improves efficiency in conduction, making this transistor ideal for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NTQD4154ZR2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTQD4154ZR2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7