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NTQD4154ZR2G

Onsemi

NTQD4154ZR2G by Onsemi

NTQD4154ZR2G by Onsemi is an N-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring COMMON DRAIN configuration, it has 2 elements with built-in diode and resistor. With a max IDM of 30A and ID of 7.5A, this MOSFET operates in ENHANCEMENT MODE and has a 0.019 ohm Drain-Source On Resistance.

Median Price

$0.439

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.423

1k+ parts

$0.351

10k+ parts

$0.313

4,000

-

$0.423

$0.351

$0.313

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.530

10k+ parts

-

4,000

-

-

$0.530

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Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.439

10k+ parts

-

4,000

-

-

$0.439

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,210 parts In-Stock

1+ parts

$0.330

100+ parts

-

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1,210

$0.330

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Vyrian

USA . 422 parts In-Stock

1+ parts

$0.347

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422

$0.347

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DigiKey Marketplace

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.360

1k+ parts

-

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-

4,000

-

$0.360

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 306 parts In-Stock

1+ parts

$0.279

100+ parts

-

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306

$0.279

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Corphita

USA . 1,690 parts In-Stock

1+ parts

$0.312

100+ parts

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1,690

$0.312

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TANS Electronics

Latvia . 6,754 parts In-Stock

1+ parts

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6,754

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Kulean Microsystems

USA . 5,938 parts In-Stock

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5,938

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

1+ parts

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$0.279

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4,000

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$0.279

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Problanco Electronics

Mexico . 2,653 parts In-Stock

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2,653

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UHIMA Technologies

Türkiye . 938 parts In-Stock

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938

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SupplyDigital Components

Austria . 813 parts In-Stock

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813

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Overview

Unleash the power of innovation with the NTQD4154ZR2G by Onsemi. This Power FET is designed for maximum efficiency and reliability, making it the perfect choice for a wide range of switching applications. With Onsemi's reputation for excellence in semiconductor technology, you can trust that this transistor will deliver exceptional performance every time. Say goodbye to compromise and hello to seamless operation with the NTQD4154ZR2G. Elevate your projects to new heights with this cutting-edge solution that offers unparalleled value and benefits for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and provides protection for the internal components, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower conduction losses and higher efficiency, making them suitable for various switching applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The common drain configuration with built-in diode and resistor simplifies circuit design and enhances performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-resistance for efficient power management.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Pulsed Drain Current (IDM): 30 A

With a high maximum pulsed drain current, this FET can handle sudden surges of power without failing, making it suitable for demanding applications.

Maximum Drain Current (ID): 7.5 A

The high maximum drain current rating allows for reliable operation under normal operating conditions, ensuring stability and performance.

Maximum Drain-Source On Resistance: 0.019 ohm

The low drain-source on resistance minimizes power losses and heat dissipation, leading to higher efficiency and improved overall performance.

Technical Specifications

Power Field Effect Transistors (FET) NTQD4154ZR2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTQD4154ZR2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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