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NTQD6968N

Onsemi

NTQD6968N by Onsemi

NTQD6968N by Onsemi is an N-CHANNEL FET with 20V DS breakdown voltage and 6.2A max drain current. Commonly used for switching applications, it features a common drain configuration, 2 elements with built-in diode, and operates in enhancement mode. The transistor has a 0.03 ohm max on resistance and can handle up to 18A pulsed drain current.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39 parts In-Stock

1+ parts

-

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$0.238

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$0.197

10k+ parts

$0.176

39

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$0.238

$0.197

$0.176

Distributors (In-Stock)

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Digiode

USA . 2,471 parts In-Stock

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$0.185

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$0.185

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Vyrian

USA . 8,372 parts In-Stock

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8,372

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Corphita

USA . 1,743 parts In-Stock

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$0.176

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$0.176

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Corohmni

South Africa . 174 parts In-Stock

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$0.195

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174

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AZTECH Wire

Italy . 97 parts In-Stock

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$20.590

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97

$20.590

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QUARKTWIN TECHNOLOGY LTD

USA . 10,859 parts In-Stock

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10,859

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SupplyDigital Components

Austria . 5,019 parts In-Stock

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TANS Electronics

Latvia . 2,343 parts In-Stock

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UHIMA Technologies

Türkiye . 927 parts In-Stock

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Kulean Microsystems

USA . 479 parts In-Stock

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Problanco Electronics

Mexico . 473 parts In-Stock

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Overview

Unlock the power of your devices with the NTQD6968N Power Field Effect Transistor by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge technology that meets the demands of various applications. This N-CHANNEL FET features a COMMON DRAIN configuration with 2 elements and a built-in diode, making it ideal for switching purposes. With a minimum DS Breakdown Voltage of 20V and a Maximum Drain Current of 6.2A, this transistor offers exceptional performance and efficiency. Trust Onsemi to provide innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically more efficient and have faster switching speeds compared to P-channel FETs, making this product suitable for high-performance applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes, enhancing the reliability of the product in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and reliability in controlling power flow.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the output voltage and current, making this product suitable for a wide range of applications requiring precise regulation.

Maximum Pulsed Drain Current (IDM): 18 A

With a high maximum pulsed drain current, this product can handle sudden surges of power without compromising performance or reliability.

No. of Terminals: 8

Having 8 terminals allows for more connection options and flexibility in circuit design, making this product versatile for various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers efficient power management and low power consumption, making this product ideal for energy-efficient applications.

Maximum Drain-Source On Resistance: 0.03 ohm

With low drain-source on resistance, this product minimizes power loss and heat generation, contributing to overall efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) NTQD6968N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

6.2 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTQD6968N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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