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NTQD4154Z

Onsemi

NTQD4154Z by Onsemi

NTQD4154Z by Onsemi is an N-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features COMMON DRAIN configuration, 2 ELEMENTS with built-in DIODE and RESISTOR. With a max IDM of 30A and ID of 7.5A, this MOSFET in SMALL OUTLINE package is suitable for various power control needs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,270 parts In-Stock

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Digiode

USA . 1,548 parts In-Stock

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1,548

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Kulean Microsystems

USA . 7,349 parts In-Stock

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TANS Electronics

Latvia . 6,651 parts In-Stock

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SupplyDigital Components

Austria . 6,579 parts In-Stock

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6,579

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Problanco Electronics

Mexico . 4,822 parts In-Stock

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4,822

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UHIMA Technologies

Türkiye . 447 parts In-Stock

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447

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Corphita

USA . 312 parts In-Stock

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Corohmni

South Africa . 102 parts In-Stock

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Overview

Experience unrivaled performance with the NTQD4154Z by Onsemi. Crafted with precision and expertise, this power field effect transistor is designed to deliver exceptional quality and reliability. Ideal for switching applications, this N-channel transistor boasts a common drain configuration with built-in diode and resistor elements, ensuring seamless operation. With a maximum pulsed drain current of 30A and a minimum DS breakdown voltage of 20V, this transistor offers unmatched efficiency and durability. Trust Onsemi's legacy of excellence and elevate your projects with the NTQD4154Z.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in the N-channel configuration, enhancing the transistor's performance.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

Offers versatile functionality with built-in components, simplifying circuit designs and saving space.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Facilitates easy installation on a PCB, making it convenient for manufacturing processes.

Minimum DS Breakdown Voltage: 20 V

Provides a suitable level of breakdown voltage for handling different power requirements in circuits.

Package Shape: RECTANGULAR

Offers a compact design that helps in saving space and enables efficient layout in PCB designs.

Terminal Form: GULL WING

Enables easy soldering onto the PCB, ensuring secure connections for reliable performance.

Operating Mode: ENHANCEMENT MODE

Operates efficiently in enhancement mode, offering high switching speeds and low on-resistance.

No. of Elements: 2

Having two elements provides redundancy and improves overall performance and reliability.

Maximum Pulsed Drain Current (IDM): 30 A

Capable of handling high pulsed current loads, making it suitable for demanding applications.

No. of Terminals: 8

Provides multiple connection points for versatile circuit configurations and applications.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the PCB and allows for efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for improved performance, low power consumption, and high switching speeds.

Transistor Element Material: SILICON

Silicon-based material ensures high reliability, temperature stability, and performance of the transistor.

Maximum Drain Current (ID): 7.5 A

Capable of handling moderate continuous current levels, suitable for various applications.

Maximum Drain-Source On Resistance: 0.019 ohm

Low on-resistance minimizes power losses and improves efficiency during operation.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connections and layout, enhancing usability.

Technical Specifications

Power Field Effect Transistors (FET) NTQD4154Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTQD4154Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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