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NTP5860NL

Onsemi

NTP5860NL by Onsemi

NTP5860NL by Onsemi is a Power FET with 60V DS Breakdown Voltage, 130A Max Drain Current, and 0.0034 ohm Max RDS(on). It is an N-CHANNEL transistor in PLASTIC/EPOXY package for applications requiring high current handling like power supplies and motor control.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 1,639 parts In-Stock

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Digiode

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 7,992 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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SupplyDigital Components

Austria . 1,926 parts In-Stock

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Corphita

USA . 1,410 parts In-Stock

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TANS Electronics

Latvia . 1,249 parts In-Stock

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UHIMA Technologies

Türkiye . 592 parts In-Stock

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Corohmni

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Overview

Upgrade your power systems with the NTP5860NL by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor offers unparalleled quality and performance. Ideal for a variety of applications, this N-CHANNEL FET provides reliable and efficient power management solutions. With a built-in diode and a high breakdown voltage of 60V, this transistor ensures enhanced durability and protection. Say goodbye to power inefficiencies and hello to seamless operations with the NTP5860NL - the perfect choice for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher current-carrying capability compared to P-channel FETs, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 60 V

The high minimum breakdown voltage allows for safe operation in high voltage circuits, providing protection against voltage spikes and fluctuations.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect against reverse voltage, enhancing the reliability and efficiency of the circuit where this FET is used.

Maximum Pulsed Drain Current (IDM): 520 A

The high pulsed drain current rating allows for handling sudden high current spikes without damage, making this FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 800 mJ

The high avalanche energy rating indicates the ability of the FET to withstand high-energy transient events, ensuring protection against voltage surges.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and good thermal stability, making this FET suitable for a wide range of applications.

Maximum Drain Current (ID): 130 A

The high maximum drain current rating enables the FET to handle large currents under continuous operation, making it suitable for high-power switching applications.

Maximum Drain-Source On Resistance: 0.0034 ohm

The low on-resistance ensures minimal voltage drop and power loss when the FET is conducting, making it energy-efficient and suitable for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP5860NL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

130 A

Maximum Drain-Source On Resistance:

.0034 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

520 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTP5860NL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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