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NTP5N60G

Onsemi

NTP5N60G by Onsemi

NTP5N60G by Onsemi is a Power FET with 600V DS breakdown voltage, 17.5A IDM, and 2.4 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max temp of 150 °C. The N-CHANNEL transistor features a built-in diode and metal-oxide semiconductor technology in a rectangular package style.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 2,318 parts In-Stock

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Digiode

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TANS Electronics

Latvia . 7,089 parts In-Stock

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Problanco Electronics

Mexico . 3,503 parts In-Stock

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Kulean Microsystems

USA . 2,456 parts In-Stock

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Corphita

USA . 1,713 parts In-Stock

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UHIMA Technologies

Türkiye . 767 parts In-Stock

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SupplyDigital Components

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Corohmni

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Overview

Experience the power of innovation with the NTP5N60G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are perfect for switching applications. With a minimum DS Breakdown Voltage of 600 V and a maximum Drain Current of 5 A, this N-CHANNEL transistor offers reliable performance and efficiency. Its SINGLE WITH BUILT-IN DIODE configuration ensures ease of use, while its ENHANCEMENT MODE operating mode maximizes functionality. Whether you're looking to enhance your electronics projects or streamline your industrial applications, the NTP5N60G provides unmatched value and versatility. Choose Onsemi for superior technology that powers your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring reliable operation in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making them a preferred choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse voltage, making the transistor suitable for various applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET is capable of quickly turning on and off, making it ideal for power control and regulation.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltages without breakdown, ensuring reliable operation in high-power circuits.

Package Shape: RECTANGULAR

The rectangular package offers easy mounting and assembly, making it convenient for integration into various electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and easy soldering, ensuring stable performance in demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the channel by applying a positive voltage, enabling precise switching and efficient power handling.

Maximum Pulsed Drain Current (IDM): 17.5 A

The high pulsed drain current rating allows for handling sudden surges in current, making the FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 80 mJ

The high avalanche energy rating indicates the FET's robustness against high-energy transients and ensures reliable operation in challenging environments.

No. of Terminals: 3

With three terminals, the FET can be easily connected in a circuit, providing flexibility in design and integration.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers mechanical stability and heat dissipation, making it suitable for high-power applications that require efficient cooling.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making the FET a dependable choice for power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the FET can withstand elevated temperatures without compromising performance, ensuring reliable operation in harsh conditions.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, offering good performance and durability for various applications.

Maximum Drain Current (ID): 5 A

The maximum drain current rating of 5 A allows for handling moderate power levels, making the FET suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 2.4 ohm

With a low drain-source on resistance, the FET minimizes power loss and heat generation, ensuring efficient operation in power circuits.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and layout, providing ease of use and enhancing overall reliability.

Case Connection: DRAIN

The drain connection offers easy access to the output terminal, simplifying circuit design and ensuring stable performance in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP5N60G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

2.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

17.5 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP5N60G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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