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NTP52N10

Onsemi

NTP52N10 by Onsemi

NTP52N10 by Onsemi is a Power FET with 100V DS Breakdown Voltage, 156A IDM, and 0.03 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. The package style is FLANGE MOUNT with SILICON element material and 150 °C max operating temp.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 1,045 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 5,494 parts In-Stock

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Problanco Electronics

Mexico . 4,307 parts In-Stock

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TANS Electronics

Latvia . 3,709 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

Germany . 1,506 parts In-Stock

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UHIMA Technologies

Türkiye . 536 parts In-Stock

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Corohmni

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Overview

Unleash the power of your next project with the NTP52N10 Power Field Effect Transistor by Onsemi. With a reputation for top-quality products, Onsemi delivers reliability and performance that you can trust. Ideal for switching applications, this N-CHANNEL transistor offers enhanced efficiency and durability. Whether you're designing industrial equipment or crafting innovative electronics, the NTP52N10 provides the value and benefits you need to succeed. Trust Onsemi to elevate your projects to new heights with the NTP52N10.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without failure, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 156 A

The high current handling capability allows this FET to switch high power loads efficiently and effectively.

Maximum Power Dissipation (Abs): 178 W

This high power dissipation rating ensures that the FET can handle high power levels without overheating, improving its reliability.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows this FET to be used in a variety of environments without performance degradation.

Maximum Drain-Source On Resistance: 0.03 ohm

The low on-resistance of this FET results in minimal power loss and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP52N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

52 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

156 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP52N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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