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NTP5860NG

Onsemi

NTP5860NG by Onsemi

NTP5860NG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 660A IDM, and 0.003 ohm RDS(on). Ideal for power applications requiring high drain current handling in enhancement mode operation. Features include built-in diode, 735mJ EAS rating, and flange mount package style.

Median Price

$2.237

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,926 parts In-Stock

1+ parts

-

100+ parts

$2.000

1k+ parts

$1.790

10k+ parts

$1.680

5,926

-

$2.000

$1.790

$1.680

DigiKey

USA . 5,926 parts In-Stock

1+ parts

-

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$2.630

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5,926

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$2.630

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Verical

USA . 3,340 parts In-Stock

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$2.237

10k+ parts

$2.100

3,340

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$2.237

$2.100

Flip Electronics (Authorized)

USA . 1,250 parts In-Stock

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1,250

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Digiode

USA . 1,450 parts In-Stock

1+ parts

$2.214

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1,450

$2.214

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Vyrian

USA . 289 parts In-Stock

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$2.330

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289

$2.330

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Flip Electronics

USA . 1,250 parts In-Stock

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Bristol Electronics

USA . 499 parts In-Stock

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499

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Distributors (Availability)

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Corphita

USA . 645 parts In-Stock

1+ parts

$2.097

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645

$2.097

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Corohmni

South Africa . 486 parts In-Stock

1+ parts

$2.330

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486

$2.330

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Microchip USA

USA . 2,037 parts In-Stock

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$14.560

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2,037

$14.560

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Kepictronics

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,400 parts In-Stock

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Lixinc

USA . 6,382 parts In-Stock

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Kulean Microsystems

USA . 5,969 parts In-Stock

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5,969

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Continental Prestige Electronics

USA . 5,791 parts In-Stock

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$2.800

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$2.800

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SupplyDigital Components

Austria . 3,579 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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TANS Electronics

Latvia . 2,984 parts In-Stock

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Perfect Parts

USA . 2,173 parts In-Stock

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Problanco Electronics

Mexico . 804 parts In-Stock

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UHIMA Technologies

Türkiye . 502 parts In-Stock

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502

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Overview

Unleash the power of innovation with the NTP5860NG by Onsemi. Designed to deliver unmatched performance in a variety of applications, this Power Field Effect Transistor boasts top-quality construction and cutting-edge technology. With a built-in diode and a maximum pulsed drain current of 660 A, this transistor offers superior efficiency and reliability. Whether you're looking to optimize your power supply or enhance your electronic systems, the NTP5860NG is the perfect choice for those who demand nothing but the best. Upgrade your components today and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the power FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower ON resistance, making them more efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and can provide protection against voltage spikes in the system.

Maximum Power Dissipation (Abs): 283 W

With a high power dissipation rating, this FET can handle large amounts of power without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

The ability to operate at high temperatures allows this FET to be used in demanding environments without performance degradation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low ON resistance, and low gate drive power, making it ideal for power management in various applications.

Maximum Drain Current (ID): 220 A

With a high drain current rating, this FET can handle large amounts of current flow, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.003 ohm

The low ON resistance of this FET results in reduced power losses and improved efficiency in power conversion applications.

Technical Specifications

Power Field Effect Transistors (FET) NTP5860NG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

735 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

220 A

Maximum Drain Current (ID):

220 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

660 A

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTP5860NG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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