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NTP5862NG

Onsemi

NTP5862NG by Onsemi

NTP5862NG by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 335A IDM, and 0.0057 ohm RDS(ON). Ideal for power applications requiring high drain current handling capacity. Suitable for use in circuits where low on-resistance and high power dissipation are crucial.

Median Price

$1.214

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

$1.170

1k+ parts

$0.971

10k+ parts

$0.866

1,700

-

$1.170

$0.971

$0.866

DigiKey

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.460

10k+ parts

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1,700

-

-

$1.460

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Verical

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.214

10k+ parts

$1.082

1,700

-

-

$1.214

$1.082

Flip Electronics (Authorized)

USA . 300 parts In-Stock

1+ parts

-

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300

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Distributors (In-Stock)

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Digiode

USA . 320 parts In-Stock

1+ parts

$0.960

100+ parts

-

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320

$0.960

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-

Chip Stock

USA . 60,000 parts In-Stock

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60,000

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Vyrian

USA . 4,980 parts In-Stock

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4,980

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Flip Electronics

USA . 300 parts In-Stock

1+ parts

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300

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 991 parts In-Stock

1+ parts

$0.909

100+ parts

-

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-

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991

$0.909

-

-

-

Corohmni

South Africa . 322 parts In-Stock

1+ parts

$1.010

100+ parts

-

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322

$1.010

-

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Component Stockers USA

USA . 1,849 parts In-Stock

1+ parts

$1.020

100+ parts

$0.960

1k+ parts

$0.870

10k+ parts

-

1,849

$1.020

$0.960

$0.870

-

Andel Nordic

Denmark . 3,710 parts In-Stock

1+ parts

$1.230

100+ parts

-

1k+ parts

$0.858

10k+ parts

$0.858

3,710

$1.230

-

$0.858

$0.858

Microchip USA

USA . 369 parts In-Stock

1+ parts

$6.305

100+ parts

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369

$6.305

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AZTECH Wire

Italy . 739 parts In-Stock

1+ parts

$17.380

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739

$17.380

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SupplyDigital Components

Austria . 8,248 parts In-Stock

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Problanco Electronics

Mexico . 5,912 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 3,472 parts In-Stock

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3,472

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Continental Prestige Electronics

USA . 1,700 parts In-Stock

1+ parts

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100+ parts

$1.210

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1,700

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$1.210

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TANS Electronics

Latvia . 1,617 parts In-Stock

1+ parts

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1,617

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UHIMA Technologies

Türkiye . 480 parts In-Stock

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480

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Perfect Parts

USA . 442 parts In-Stock

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442

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Overview

Unleash the power of innovation with the NTP5862NG Power Field Effect Transistor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products like this N-CHANNEL FET with a built-in diode, offering unmatched reliability and performance. Ideal for a wide range of applications, from power supplies to motor control, this transistor boasts high efficiency and durability, providing customers with exceptional value and benefits. Upgrade your projects with the NTP5862NG and experience the difference in quality and precision that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, suitable for various applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures the transistor can handle higher voltage levels without breakdown, enhancing reliability.

Maximum Drain Current (ID): 98 A

With a high maximum drain current rating, this transistor can handle high power applications effectively.

Maximum Power Dissipation (Abs): 115 W

The high power dissipation capability ensures the transistor can operate efficiently without overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the transistor to function in demanding environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTP5862NG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

205 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

98 A

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.0057 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

335 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTP5862NG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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