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NTP360N80S3Z

Onsemi

NTP360N80S3Z by Onsemi

NTP360N80S3Z by Onsemi is a N-CHANNEL FET with 800V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 32.5A IDM, 40mJ EAS, and 0.36 ohm RDS(on). Operating from -55 to 150 °C, it has a max power dissipation of 96W in a RECTANGULAR package with THROUGH-HOLE terminals.

Median Price

$4.610

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 211 parts In-Stock

1+ parts

$3.580

100+ parts

$2.260

1k+ parts

$1.390

10k+ parts

-

211

$3.580

$2.260

$1.390

-

DigiKey

USA . 745 parts In-Stock

1+ parts

$4.610

100+ parts

$2.159

1k+ parts

$1.659

10k+ parts

$1.639

745

$4.610

$2.159

$1.659

$1.639

Mouser Electronics

USA . 604 parts In-Stock

1+ parts

$4.610

100+ parts

$2.050

1k+ parts

$1.630

10k+ parts

-

604

$4.610

$2.050

$1.630

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Newark

USA . 196 parts In-Stock

1+ parts

$5.080

100+ parts

$2.640

1k+ parts

$2.440

10k+ parts

-

196

$5.080

$2.640

$2.440

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Element14

Singapore . 211 parts In-Stock

1+ parts

$5.720

100+ parts

$4.050

1k+ parts

$2.480

10k+ parts

-

211

$5.720

$4.050

$2.480

-

Chip1Stop

Japan . 560 parts In-Stock

1+ parts

$11.700

100+ parts

$5.020

1k+ parts

$3.690

10k+ parts

-

560

$11.700

$5.020

$3.690

-

Rochester

USA . 5,173 parts In-Stock

1+ parts

-

100+ parts

$1.640

1k+ parts

$1.470

10k+ parts

$1.380

5,173

-

$1.640

$1.470

$1.380

Verical

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.837

10k+ parts

-

3,200

-

-

$1.837

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,062 parts In-Stock

1+ parts

$1.644

100+ parts

-

1k+ parts

-

10k+ parts

-

1,062

$1.644

-

-

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Vyrian

USA . 1,213 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,213

$1.730

-

-

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TME

Poland . 50 parts In-Stock

1+ parts

$3.620

100+ parts

$2.210

1k+ parts

-

10k+ parts

-

50

$3.620

$2.210

-

-

Flip Electronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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800

-

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Distributors (Availability)

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Corphita

USA . 441 parts In-Stock

1+ parts

$1.557

100+ parts

-

1k+ parts

-

10k+ parts

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441

$1.557

-

-

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Corohmni

South Africa . 182 parts In-Stock

1+ parts

$1.730

100+ parts

-

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-

10k+ parts

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182

$1.730

-

-

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Continental Prestige Electronics

USA . 211 parts In-Stock

1+ parts

$2.310

100+ parts

$1.450

1k+ parts

$1.390

10k+ parts

-

211

$2.310

$1.450

$1.390

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Microchip USA

USA . 4,547 parts In-Stock

1+ parts

$23.920

100+ parts

-

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4,547

$23.920

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QUARKTWIN TECHNOLOGY LTD

USA . 18,089 parts In-Stock

1+ parts

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18,089

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Perfect Parts

USA . 13,664 parts In-Stock

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13,664

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TANS Electronics

Latvia . 8,117 parts In-Stock

1+ parts

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8,117

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SupplyDigital Components

Austria . 1,481 parts In-Stock

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1,481

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UHIMA Technologies

Türkiye . 751 parts In-Stock

1+ parts

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751

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GreenTree Electronics

Israel . 660 parts In-Stock

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660

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Problanco Electronics

Mexico . 629 parts In-Stock

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629

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Kulean Microsystems

USA . 610 parts In-Stock

1+ parts

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610

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Overview

Discover the power of the NTP360N80S3Z by Onsemi, a high-quality Power Field Effect Transistor that offers reliable performance in a variety of switching applications. With its N-CHANNEL configuration and built-in diode, this transistor provides enhanced efficiency and optimal power management. Whether you're working on industrial equipment, automotive systems, or renewable energy solutions, this transistor's 800V DS Breakdown Voltage and 96W Maximum Power Dissipation ensure exceptional reliability and durability. Trust Onsemi's expertise and choose the NTP360N80S3Z for all your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides a cost-effective and lightweight solution.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher electron mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances performance by preventing reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low losses.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can handle high voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and compact layout in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide sturdy connections and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the device with positive gate voltage, making them ideal for various applications.

Maximum Pulsed Drain Current (IDM): 32.5 A

With a high pulsed drain current rating, this FET can handle short-term high current loads efficiently.

Avalanche Energy Rating (EAS): 40 mJ

The high avalanche energy rating ensures reliable operation in applications with high energy transients.

Maximum Drain Current (Abs) (ID): 13 A

The high drain current rating allows for reliable operation in continuous current applications.

No. of Terminals: 3

With three terminals, this FET provides necessary connections for power and control signals.

Maximum Power Dissipation (Abs): 96 W

With a high power dissipation rating, this FET can handle high power levels without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy and secure mounting in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low leakage current and high switching speeds for efficient performance.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon-based FETs offer high thermal conductivity and reliability for long-term operation.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this FET can operate in extreme cold environments without issues.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides corrosion resistance and reliable solder joints for long-term durability.

Maximum Drain-Source On Resistance: 0.36 ohm

The low on-resistance of the FET reduces power losses and improves efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and layout for easy integration.

Technical Specifications

Power Field Effect Transistors (FET) NTP360N80S3Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

40 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32.5 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP360N80S3Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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