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NTP35N15

Onsemi

NTP35N15 by Onsemi

NTP35N15 by Onsemi is a Power FET with 150V DS Breakdown Voltage, 37A Drain Current, and 0.05 ohm On Resistance. It is used for switching applications in enhancement mode with a max power dissipation of 178W. The transistor features an N-CHANNEL configuration, built-in diode, and operates at temperatures up to 150 °C.

Median Price

$0.898

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17,597 parts In-Stock

1+ parts

-

100+ parts

$0.898

1k+ parts

$0.746

10k+ parts

$0.665

17,597

-

$0.898

$0.746

$0.665

DigiKey

USA . 17,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.770

10k+ parts

$0.770

17,597

-

-

$0.770

$0.770

Verical

USA . 17,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.932

10k+ parts

$0.831

17,597

-

-

$0.932

$0.831

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,034 parts In-Stock

1+ parts

$0.597

100+ parts

-

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-

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-

2,034

$0.597

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-

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Digiode

USA . 302 parts In-Stock

1+ parts

$0.700

100+ parts

-

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302

$0.700

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 199 parts In-Stock

1+ parts

$0.597

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-

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199

$0.597

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Corphita

USA . 2,038 parts In-Stock

1+ parts

$0.663

100+ parts

-

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2,038

$0.663

-

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Component Stockers USA

USA . 17,189 parts In-Stock

1+ parts

$0.750

100+ parts

$0.700

1k+ parts

$0.630

10k+ parts

$0.630

17,189

$0.750

$0.700

$0.630

$0.630

Microchip USA

USA . 142 parts In-Stock

1+ parts

$4.615

100+ parts

-

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142

$4.615

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Continental Prestige Electronics

USA . 17,597 parts In-Stock

1+ parts

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100+ parts

$0.597

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17,597

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$0.597

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Problanco Electronics

Mexico . 7,672 parts In-Stock

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7,672

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Kulean Microsystems

USA . 4,506 parts In-Stock

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4,506

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TANS Electronics

Latvia . 3,849 parts In-Stock

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3,849

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SupplyDigital Components

Austria . 659 parts In-Stock

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659

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UHIMA Technologies

Türkiye . 479 parts In-Stock

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479

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Overview

Unleash the power of innovation with the NTP35N15 from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). Ideal for switching applications, this N-CHANNEL transistor offers enhanced performance and efficiency. With a maximum drain current of 37 A and a low on-resistance of 0.05 ohm, this transistor provides exceptional value and benefits to customers looking for high-performance solutions. Trust Onsemi to provide the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product resistant to external factors such as moisture or vibrations.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by including a built-in diode, reducing the need for additional components and optimizing space usage.

Minimum DS Breakdown Voltage: 150 V

Offers a high breakdown voltage, ensuring the safe operation of the transistor in high voltage applications.

Transistor Application: SWITCHING

Designed for switching applications, allowing for efficient control and regulation of current flow in a circuit.

Maximum Power Dissipation (Abs): 178 W

With a high power dissipation rating, the transistor can handle significant power levels without overheating, ensuring reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) NTP35N15 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

700 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

37 A

Maximum Drain Current (ID):

37 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

111 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP35N15 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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