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NTP30N06LG

Onsemi

NTP30N06LG by Onsemi

NTP30N06LG by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 30A Drain Current, and 0.046 ohm On Resistance. Ideal for SWITCHING applications due to its 90A Pulsed Drain Current and 101mJ Avalanche Energy Rating. Package: PLASTIC/EPOXY, RECTANGULAR shape, THROUGH-HOLE terminals.

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1k+

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Vyrian

USA . 7,641 parts In-Stock

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Digiode

USA . 1,614 parts In-Stock

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AZTECH Wire

Italy . 608 parts In-Stock

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$19.100

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Component Stockers USA

USA . 234 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 9,500 parts In-Stock

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Problanco Electronics

Mexico . 7,926 parts In-Stock

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Kulean Microsystems

USA . 5,372 parts In-Stock

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SupplyDigital Components

Austria . 4,087 parts In-Stock

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TANS Electronics

Latvia . 3,420 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

Germany . 1,502 parts In-Stock

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UHIMA Technologies

Türkiye . 738 parts In-Stock

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Corohmni

South Africa . 140 parts In-Stock

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Overview

Experience the power and reliability of the NTP30N06LG by Onsemi, a top-tier manufacturer in the industry. This Power Field Effect Transistor (FET) is perfect for various applications such as switching, thanks to its high-quality construction and advanced technology. With a maximum drain current of 30A and a low on-resistance, this transistor offers unmatched performance and efficiency. Trust Onsemi for superior products that deliver exceptional value and benefits to customers looking for cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures that the transistor can withstand various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a good choice for applications requiring high efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes and reverse current, increasing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor is efficient and reliable in controlling the flow of power.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this transistor can handle higher voltages without breakdown, making it suitable for applications with high voltage requirements.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation in various devices or circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and stable connection, ensuring reliable performance in different conditions.

Maximum Pulsed Drain Current (IDM): 90 A

With a high maximum pulsed drain current, this transistor can handle surges in current without damage, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 101 mJ

The high avalanche energy rating indicates that this transistor can withstand energy surges, ensuring long-term reliability in harsh operating conditions.

Maximum Drain Current (Abs) (ID): 30 A

With a high maximum drain current rating, this transistor can handle high currents without overheating, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 88.2 W

The high power dissipation rating allows this transistor to handle high power levels without overheating, ensuring long-term reliability.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy installation and heat dissipation, making it suitable for applications that require efficient thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and efficiency, making this transistor a good choice for demanding applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can withstand high temperatures without performance degradation, ensuring reliability in harsh environments.

Transistor Element Material: SILICON

Silicon-based transistors are known for their reliability and efficiency, making this product a good choice for long-term performance.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring stable electrical connections for reliable performance.

Maximum Drain-Source On Resistance: 0.046 ohm

With low drain-source on resistance, this transistor offers efficient power handling and low power loss, making it suitable for high-efficiency applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and makes it easier to connect in circuits, enhancing usability and reliability.

Case Connection: DRAIN

The drain case connection is commonly used in power transistors, providing efficient heat dissipation and ensuring reliability in high-power applications.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this transistor can withstand high-temperature soldering processes, ensuring reliable connections during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTP30N06LG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

101 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

90 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP30N06LG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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