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NTP30N20G

Onsemi

NTP30N20G by Onsemi

NTP30N20G by Onsemi is a Power FET with 200V DS Breakdown Voltage, 90A IDM, and 0.081 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with SILICON transistor element material.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,541 parts In-Stock

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Digiode

USA . 681 parts In-Stock

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AZTECH Wire

Italy . 298 parts In-Stock

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$21.390

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SupplyDigital Components

Austria . 7,652 parts In-Stock

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Problanco Electronics

Mexico . 7,540 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,726 parts In-Stock

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TANS Electronics

Latvia . 5,359 parts In-Stock

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Kulean Microsystems

USA . 2,608 parts In-Stock

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Corphita

USA . 2,250 parts In-Stock

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Corohmni

South Africa . 347 parts In-Stock

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GreenTree Electronics

Israel . 200 parts In-Stock

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Kepictronics

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UHIMA Technologies

Türkiye . 84 parts In-Stock

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Overview

Unleash the power of innovation with the NTP30N20G Power Field Effect Transistor by Onsemi. This high-quality N-channel transistor offers enhanced performance in switching applications, providing reliable and efficient operation. With a maximum drain current of 30A and a low on-resistance of 0.081 ohm, this transistor delivers exceptional power handling capabilities. Whether you're designing industrial equipment or automotive systems, the NTP30N20G will elevate your projects to new heights. Trust Onsemi's expertise in semiconductor technology to bring you the best in power transistors. Upgrade your designs today and experience the difference with the NTP30N20G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their superior performance and efficiency in switching applications, making this product a reliable choice.

Minimum DS Breakdown Voltage: 200 V

With a minimum breakdown voltage of 200 V, this FET can handle high voltage applications effectively and safely.

Maximum Pulsed Drain Current (IDM): 90 A

The high pulsed drain current rating of 90 A allows this FET to handle peak current demands without any issues, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 178 W

With a maximum power dissipation of 178 W, this FET can handle high power levels efficiently without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures that this FET can operate reliably in various temperature conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTP30N20G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

450 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.081 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

90 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTP30N20G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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