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NTMTS0D4N04CLTXG

Onsemi

NTMTS0D4N04CLTXG by Onsemi

NTMTS0D4N04CLTXG by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 900A Pulsed Drain Current. Ideal for applications requiring high power dissipation, such as automotive systems and industrial equipment. Features include a built-in diode, small outline package style, and an operating temperature range of -55 to 175 °C.

Median Price

$1.975

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,439 parts In-Stock

1+ parts

$5.170

100+ parts

$2.452

1k+ parts

$2.341

10k+ parts

$1.913

3,439

$5.170

$2.452

$2.341

$1.913

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$1.770

1k+ parts

$1.580

10k+ parts

$1.490

6,000

-

$1.770

$1.580

$1.490

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.975

10k+ parts

$1.863

6,000

-

-

$1.975

$1.863

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,819 parts In-Stock

1+ parts

$2.983

100+ parts

-

1k+ parts

-

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1,819

$2.983

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Vyrian

USA . 2,576 parts In-Stock

1+ parts

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2,576

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Distributors (Availability)

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Corphita

USA . 2,365 parts In-Stock

1+ parts

$2.826

100+ parts

-

1k+ parts

-

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-

2,365

$2.826

-

-

-

Corohmni

South Africa . 159 parts In-Stock

1+ parts

$3.300

100+ parts

-

1k+ parts

-

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-

159

$3.300

-

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-

Component Stockers USA

USA . 2,026 parts In-Stock

1+ parts

$14.710

100+ parts

$11.200

1k+ parts

$9.310

10k+ parts

-

2,026

$14.710

$11.200

$9.310

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QUARKTWIN TECHNOLOGY LTD

USA . 12,986 parts In-Stock

1+ parts

-

100+ parts

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12,986

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Problanco Electronics

Mexico . 6,054 parts In-Stock

1+ parts

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6,054

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Kulean Microsystems

USA . 4,354 parts In-Stock

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4,354

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Microchip USA

USA . 4,056 parts In-Stock

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4,056

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UHIMA Technologies

Türkiye . 662 parts In-Stock

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662

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SupplyDigital Components

Austria . 427 parts In-Stock

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427

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TANS Electronics

Latvia . 59 parts In-Stock

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59

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Overview

Looking for a reliable power field effect transistor (FET) for your electronic projects? Look no further than the NTMTS0D4N04CLTXG by Onsemi. With its high-quality construction and N-channel configuration, this FET offers exceptional performance and durability. Whether you're designing power supplies, motor control circuits, or voltage regulators, this transistor is sure to deliver excellent results. Trust Onsemi's expertise in semiconductor technology and choose this FET for all your power management needs. Experience the value and benefits of this top-of-the-line component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor durable and resistant to external elements, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and low ON-resistance, making this transistor suitable for high performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the transistor allows for easy protection against reverse polarity and inductive kickback, simplifying circuit design.

Maximum Pulsed Drain Current (IDM): 900 A

With a high pulsed drain current, this transistor can handle sudden spikes in current, making it suitable for applications requiring high power handling capabilities.

Maximum Power Dissipation (Abs): 244 W

The high power dissipation capability of this transistor allows it to operate efficiently even under high load conditions, ensuring reliability in operation.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMTS0D4N04CLTXG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

4454 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

553.8 A

Maximum Drain Current (ID):

553.8 A

Maximum Drain-Source On Resistance:

.00064 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

390 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMTS0D4N04CLTXG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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