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NTMFS5C442NLTT3G

Onsemi

NTMFS5C442NLTT3G by Onsemi

The Onsemi NTMFS5C442NLTT3G is a N-CHANNEL FET with 40V DS Breakdown Voltage, 130A ID, and 0.0037 ohm RDS(ON). It is used in power applications due to its 900A IDM, 265mJ EAS rating, and -55 to 175 °C operating temperature range.

Median Price

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Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Flip Electronics

USA . 5,100 parts In-Stock

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Vyrian

USA . 3,425 parts In-Stock

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Digiode

USA . 1,759 parts In-Stock

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AZTECH Wire

Italy . 272 parts In-Stock

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Perfect Parts

USA . 37,206 parts In-Stock

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TANS Electronics

Latvia . 5,450 parts In-Stock

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GreenTree Electronics

Israel . 4,960 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 3,932 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,379 parts In-Stock

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Corphita

USA . 1,992 parts In-Stock

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SupplyDigital Components

Austria . 1,734 parts In-Stock

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Kulean Microsystems

USA . 1,420 parts In-Stock

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Corohmni

South Africa . 358 parts In-Stock

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UHIMA Technologies

Türkiye . 149 parts In-Stock

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Overview

Experience superior performance and reliability with the NTMFS5C442NLTT3G by Onsemi. As a leading manufacturer, Onsemi delivers top-quality Power Field Effect Transistors designed for various applications. This N-CHANNEL FET offers unmatched value with its built-in diode, high current capacity, and low resistance. Whether you're looking to enhance power efficiency in automotive, industrial, or consumer electronics, this product is the perfect choice. Trust Onsemi for cutting-edge technology and exceptional products that deliver outstanding results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs have lower on-resistance compared to P-Channel FETs, making them more efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse current flow, enhancing the reliability of the circuit.

Surface Mount: YES

Surface mount technology makes for easy and reliable PCB assembly, saving space and reducing production costs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use in most applications, as they are normally off until a voltage is applied to the gate.

Maximum Pulsed Drain Current (IDM): 900 A

The high maximum pulsed drain current rating ensures that the FET can handle sudden surge currents without being damaged.

Avalanche Energy Rating (EAS): 265 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transients without failing.

Maximum Power Dissipation (Abs): 83 W

The high maximum power dissipation rating allows the FET to handle high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, making this FET suitable for power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature rating ensures the FET can operate reliably in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5C442NLTT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

265 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

130 A

Maximum Drain Current (ID):

130 A

Maximum Drain-Source On Resistance:

.0037 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

37 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5C442NLTT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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