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NTMFS5C404NLTT1G

Onsemi

NTMFS5C404NLTT1G by Onsemi

NTMFS5C404NLTT1G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 900A IDM, and 0.001 ohm RDS(on). It is used in power applications due to its 200W Pdiss, -55 to 175 °C operating temp range, and DUAL terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,987 parts In-Stock

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Digiode

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Microchip USA

USA . 6,732 parts In-Stock

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AZTECH Wire

Italy . 1,211 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 8,133 parts In-Stock

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Kulean Microsystems

USA . 6,541 parts In-Stock

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Problanco Electronics

Mexico . 4,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,862 parts In-Stock

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TANS Electronics

Latvia . 1,544 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 407 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Unlock the power of innovation with the NTMFS5C404NLTT1G by Onsemi. Designed for high-performance applications, this N-CHANNEL Power FET offers unparalleled reliability and efficiency. With a maximum drain current of 370A and a minimum operating temperature of -55 °C, this transistor is perfect for a wide range of industrial and automotive applications. Experience seamless operation and superior performance with this cutting-edge technology from a trusted manufacturer like Onsemi. Elevate your projects with the NTMFS5C404NLTT1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or high vibration applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher switching speeds compared to P-channel FETs, making them more efficient in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse polarity protection and simplifies circuit design for applications requiring freewheeling diodes.

Surface Mount: YES

Surface mount compatibility allows for easy and reliable PCB assembly, saving time and cost.

Minimum DS Breakdown Voltage: 40 V

A high breakdown voltage ensures the FET can handle higher voltage loads and provides reliable operation under various conditions.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating allows for handling sudden peak power demands without compromising performance or reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds, low ON resistance, and high input impedance, making the FET suitable for high-frequency applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand harsh environmental conditions and operate reliably in industrial or automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5C404NLTT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

907 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

370 A

Maximum Drain Current (ID):

370 A

Maximum Drain-Source On Resistance:

.001 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5C404NLTT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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