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NTMFS4982NFT1G

Onsemi

NTMFS4982NFT1G by Onsemi

NTMFS4982NFT1G by Onsemi is a N-CHANNEL FET for SWITCHING applications. It has a 30V DS Breakdown Voltage, 350A IDM, and 0.0019 ohm RDS(on). With a max power dissipation of 89.3W and operating temperature of 150 °C, it offers high performance in a small outline package.

Median Price

$0.934

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,500 parts In-Stock

1+ parts

-

100+ parts

$0.917

1k+ parts

$0.761

10k+ parts

$0.678

19,500

-

$0.917

$0.761

$0.678

Verical

USA . 10,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.951

10k+ parts

$0.848

10,500

-

-

$0.951

$0.848

Distributors (In-Stock)

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Digiode

USA . 2,251 parts In-Stock

1+ parts

$0.712

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2,251

$0.712

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Flip Electronics

USA . 90,000 parts In-Stock

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90,000

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Chip Stock

USA . 17,000 parts In-Stock

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Vyrian

USA . 5,015 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 526 parts In-Stock

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$0.675

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526

$0.675

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Corohmni

South Africa . 253 parts In-Stock

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$0.750

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253

$0.750

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AZTECH Wire

Italy . 41 parts In-Stock

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$19.160

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41

$19.160

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Perfect Parts

USA . 49,108 parts In-Stock

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TANS Electronics

Latvia . 6,418 parts In-Stock

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RC Electronics

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,818 parts In-Stock

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Problanco Electronics

Mexico . 4,442 parts In-Stock

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Kulean Microsystems

USA . 4,218 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 1,290 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Futuretech Components

Singapore . 773 parts In-Stock

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UHIMA Technologies

Türkiye . 736 parts In-Stock

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Kepictronics

USA . 615 parts In-Stock

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615

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Overview

Unlock the power of innovation with the NTMFS4982NFT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). Designed for switching applications, this N-CHANNEL transistor offers enhanced performance and efficiency. With a maximum pulsing drain current of 350 A and a low on-resistance of 0.0019 ohm, this transistor is ideal for high-power applications. Trust Onsemi to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NTMFS4982NFT1G and experience the difference in performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material makes the transistor durable and resistant to external environmental factors, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher electron mobility, making them ideal for high power applications and efficient switching.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Drain-Source On Resistance: 0.0019 ohm

The low on-resistance of the transistor results in minimal power loss and high efficiency during operation, making it suitable for high-current applications.

Maximum Drain Current (ID): 26.5 A

The high maximum drain current rating allows the transistor to handle higher currents without overheating, making it suitable for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4982NFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

36 A

Maximum Drain Current (ID):

26.5 A

Maximum Drain-Source On Resistance:

.0019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

350 A

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4982NFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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