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NTMFS4965NFT3G

Onsemi

NTMFS4965NFT3G by Onsemi

NTMFS4965NFT3G by Onsemi is a N-CHANNEL FET with 65A max drain current and 22.73W power dissipation. Ideal for power applications, it operates in enhancement mode with a max temp of 150 °C. Suitable for surface mount configurations, this MOSFET is widely used in high-power electronic devices.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,530 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 457 parts In-Stock

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$17.600

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Component Stockers USA

USA . 544 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 7,726 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,745 parts In-Stock

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SupplyDigital Components

Austria . 5,872 parts In-Stock

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Kulean Microsystems

USA . 2,767 parts In-Stock

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Corphita

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Problanco Electronics

Mexico . 612 parts In-Stock

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UHIMA Technologies

Türkiye . 224 parts In-Stock

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Corohmni

South Africa . 83 parts In-Stock

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Overview

Experience unprecedented power and efficiency with the Onsemi NTMFS4965NFT3G Power Field Effect Transistor. Known for its high-quality manufacturing, Onsemi delivers top-of-the-line N-CHANNEL FETs that guarantee superior performance in various applications. From enhancing power conversion systems to improving motor control, this single configuration FET offers unmatched reliability and durability. Don't settle for less when you can have the best - choose Onsemi for all your power transistor needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making them ideal for power applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and control in circuit designs, offering more straightforward operation.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and efficient use of PCB space, making the product suitable for small form factor applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide easier control and higher performance in power switching applications.

Maximum Drain Current (Abs): 65 A

High maximum drain current capability ensures the FET can handle high power loads without overheating or failure.

Maximum Power Dissipation (Abs): 22.73 W

High power dissipation capability allows the FET to operate efficiently and reliably under varying load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved gate control and reduced leakage currents, enhancing overall performance.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures the FET can operate reliably in demanding environments without thermal issues.

Terminal Finish: TIN

Tin terminal finish provides good solderability and electrical conductivity, contributing to the overall reliability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time ensures proper soldering of the FET onto the PCB, reducing the risk of damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for efficient and reliable soldering of the FET during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4965NFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4965NFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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