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NTMFS4933NT1G

Onsemi

NTMFS4933NT1G by Onsemi

Power Field-Effect Transistors; Peak Reflow Temperature (C): 260; Maximum Drain Current (Abs) (ID): 210 A; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$1.813

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 169 parts In-Stock

1+ parts

$11.100

100+ parts

$4.780

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169

$11.100

$4.780

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Rochester

USA . 2,299 parts In-Stock

1+ parts

-

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$1.620

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$1.450

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$1.370

2,299

-

$1.620

$1.450

$1.370

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

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$1.813

10k+ parts

$1.712

1,500

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-

$1.813

$1.712

Distributors (In-Stock)

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Digiode

USA . 1,037 parts In-Stock

1+ parts

$1.805

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1,037

$1.805

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Chip Stock

USA . 50,000 parts In-Stock

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Vyrian

USA . 9,167 parts In-Stock

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9,167

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Cyclops Electronics Ltd

UK . 1,500 parts In-Stock

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1,500

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Flip Electronics

USA . 170 parts In-Stock

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170

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Distributors (Availability)

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Corphita

USA . 1,954 parts In-Stock

1+ parts

$1.710

100+ parts

-

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1,954

$1.710

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Corohmni

South Africa . 450 parts In-Stock

1+ parts

$1.900

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450

$1.900

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AZTECH Wire

Italy . 453 parts In-Stock

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$16.400

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453

$16.400

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Problanco Electronics

Mexico . 6,580 parts In-Stock

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6,580

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A-Z Elektronik GmbH

Germany . 5,322 parts In-Stock

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5,322

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Kulean Microsystems

USA . 4,034 parts In-Stock

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SupplyDigital Components

Austria . 3,154 parts In-Stock

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Kepictronics

USA . 1,515 parts In-Stock

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1,515

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GreenTree Electronics

Israel . 1,500 parts In-Stock

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Perfect Parts

USA . 1,325 parts In-Stock

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1,325

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TANS Electronics

Latvia . 1,224 parts In-Stock

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Futuretech Components

Singapore . 131 parts In-Stock

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131

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UHIMA Technologies

Türkiye . 6 parts In-Stock

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6

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Technical Specifications

Power Field Effect Transistors (FET) NTMFS4933NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

210 A

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Sub-Category:

FET General Purpose Power

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4933NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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