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NTMFS4852NT1G

Onsemi

NTMFS4852NT1G by Onsemi

NTMFS4852NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 310A IDM, and 0.0033 ohm RDS(on). Ideal for SWITCHING applications due to its 155A ID, 360mJ EAS rating, and ENHANCEMENT MODE operation. Suitable for high-power systems requiring efficient power dissipation in a SMALL OUTLINE package.

Median Price

$0.852

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 855 parts In-Stock

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$0.509

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855

$0.509

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Chip1Stop

Japan . 855 parts In-Stock

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$0.852

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$0.539

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855

$0.852

$0.539

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DigiKey

USA . 213 parts In-Stock

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$2.120

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$0.922

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213

$2.120

$0.922

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Rochester

USA . 2,049 parts In-Stock

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$0.846

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$0.702

10k+ parts

$0.626

2,049

-

$0.846

$0.702

$0.626

Verical

USA . 1,324 parts In-Stock

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$0.877

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$0.782

1,324

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$0.782

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Flip Electronics

USA . 1,100 parts In-Stock

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$0.360

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$0.360

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Digiode

USA . 740 parts In-Stock

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$0.591

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$0.591

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Vyrian

USA . 2,151 parts In-Stock

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Corphita

USA . 152 parts In-Stock

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$0.560

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$0.560

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Corohmni

South Africa . 130 parts In-Stock

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$0.560

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Perfect Parts

USA . 15,523 parts In-Stock

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Kulean Microsystems

USA . 7,802 parts In-Stock

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TANS Electronics

Latvia . 5,463 parts In-Stock

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Problanco Electronics

Mexico . 4,983 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,715 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,049 parts In-Stock

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$0.632

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Kepictronics

USA . 1,500 parts In-Stock

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RC Electronics

USA . 1,500 parts In-Stock

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Authorized Procurement Solutions

USA . 1,300 parts In-Stock

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GreenTree Electronics

Israel . 1,300 parts In-Stock

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SupplyDigital Components

Austria . 643 parts In-Stock

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UHIMA Technologies

Türkiye . 620 parts In-Stock

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Overview

Unlock the power of high-performance switching with the NTMFS4852NT1G by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors, Onsemi delivers unmatched quality and reliability. Ideal for various applications, this N-CHANNEL FET provides exceptional value with its built-in diode and enhancement mode operation. From increased efficiency to superior performance, this transistor offers customers the advantages they need to succeed. Trust Onsemi for cutting-edge technology and maximize your potential with the NTMFS4852NT1G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for their high efficiency and fast switching speeds, making this product ideal for power applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle high voltage loads with ease.

Maximum Pulsed Drain Current (IDM): 310 A

The high pulsed drain current rating of 310A makes this FET suitable for applications where a large amount of current needs to be switched.

Maximum Power Dissipation (Abs): 86.2 W

With a high power dissipation rating, this FET can handle significant amount of power without overheating.

Maximum Operating Temperature: 150 °C

The FET can operate at temperatures up to 150 °C, allowing it to be used in strenuous environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4852NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

360 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

155 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.0033 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

310 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4852NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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