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NTMFS4839NT1G

Onsemi

NTMFS4839NT1G by Onsemi

NTMFS4839NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 132A IDM, and 0.0095 ohm RDS(ON). Ideal for SWITCHING applications in ENHANCEMENT MODE, it features a built-in DIODE and operates in SMALL OUTLINE package style.

Median Price

$0.317

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 268,110 parts In-Stock

1+ parts

-

100+ parts

$0.317

1k+ parts

$0.263

10k+ parts

$0.235

268,110

-

$0.317

$0.263

$0.235

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,428 parts In-Stock

1+ parts

$0.247

100+ parts

-

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1,428

$0.247

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Vyrian

USA . 5,727 parts In-Stock

1+ parts

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5,727

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Prism Electronics

USA . 22 parts In-Stock

1+ parts

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22

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Distributors (Availability)

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Corphita

USA . 980 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

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980

$0.234

-

-

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Corohmni

South Africa . 303 parts In-Stock

1+ parts

$0.260

100+ parts

-

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303

$0.260

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Component Stockers USA

USA . 224,497 parts In-Stock

1+ parts

$0.270

100+ parts

$0.250

1k+ parts

$0.230

10k+ parts

$0.230

224,497

$0.270

$0.250

$0.230

$0.230

AZTECH Wire

Italy . 446 parts In-Stock

1+ parts

$18.370

100+ parts

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446

$18.370

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Continental Prestige Electronics

USA . 268,110 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.238

10k+ parts

-

268,110

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$0.238

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SupplyDigital Components

Austria . 6,891 parts In-Stock

1+ parts

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6,891

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Kulean Microsystems

USA . 4,500 parts In-Stock

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4,500

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Problanco Electronics

Mexico . 3,138 parts In-Stock

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3,138

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TANS Electronics

Latvia . 2,470 parts In-Stock

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2,470

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UHIMA Technologies

Türkiye . 808 parts In-Stock

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808

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Perfect Parts

USA . 25 parts In-Stock

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25

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Overview

Looking for a high-quality Power FET that delivers superior performance? Look no further than the NTMFS4839NT1G by Onsemi. With a strong reputation for excellence in the industry, Onsemi brings you a cutting-edge N-CHANNEL FET with a built-in diode, ideal for switching applications. Its small outline package and low on-resistance make it perfect for a wide range of projects. Trust Onsemi to provide you with the reliability and efficiency you need. Upgrade your design with the NTMFS4839NT1G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from voltage spikes and reverse currents, enhancing the overall reliability of the product.

Transistor Application: SWITCHING

Specifically designed for switching applications, making it suitable for use in various electronic devices that require efficient power management.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this product can handle higher voltages safely, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and soldering onto circuit boards, improving the overall assembly process.

Terminal Form: FLAT

Flat terminals provide a secure connection and ensure efficient heat dissipation, enhancing the overall performance of the FET.

Operating Mode: ENHANCEMENT MODE

Operates in enhancement mode, offering better control over the switching characteristics and improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 132 A

With a high pulsed drain current rating of 132A, this product can handle high current spikes, making it suitable for power applications.

Avalanche Energy Rating (EAS): 180.5 mJ

The high avalanche energy rating makes this product reliable and robust, able to withstand transient voltage spikes without damage.

No. of Terminals: 5

Having 5 terminals provides flexibility in circuit design and allows for proper connection of external components, enhancing the functionality of the FET.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and improves thermal performance, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Uses MOSFET technology, known for its high efficiency and fast switching speeds, making this product a great choice for power management applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring stable performance and durability of the FET.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable connection in various operating conditions.

Maximum Drain Current (ID): 9.5 A

With a maximum drain current rating of 9.5A, this FET can handle high current loads efficiently, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.0095 ohm

Low on-resistance ensures minimal power loss and heat generation, improving the overall efficiency of the FET in power switching applications.

Terminal Position: DUAL

Dual terminal position allows for flexible installation and connection options, enhancing the usability of the FET in various circuit configurations.

Case Connection: DRAIN

The drain connection allows for easy connection to the power source and load, ensuring efficient power transfer and management in the circuit.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for up to 40 seconds, ensuring reliable soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands peak reflow temperatures of 260 °C, making it suitable for lead-free soldering processes and ensuring robust solder connections.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4839NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

180.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

9.5 A

Maximum Drain-Source On Resistance:

.0095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

132 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4839NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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