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NTLGF3402PT1G

Onsemi

NTLGF3402PT1G by Onsemi

NTLGF3402PT1G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, 11A IDM, and 0.14 ohm RDS(ON). Ideal for SWITCHING applications in ENHANCEMENT MODE, this transistor operates b/w -55 to 150 °C and features a METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$0.524

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,200 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

5,200

-

$0.515

$0.428

$0.381

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.534

10k+ parts

$0.476

3,000

-

-

$0.534

$0.476

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,189 parts In-Stock

1+ parts

$0.401

100+ parts

-

1k+ parts

-

10k+ parts

-

2,189

$0.401

-

-

-

Vyrian

USA . 2,896 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,896

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 783 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

-

783

$0.380

-

-

-

Corohmni

South Africa . 490 parts In-Stock

1+ parts

$0.422

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$0.422

-

-

-

Component Stockers USA

USA . 4,657 parts In-Stock

1+ parts

$0.440

100+ parts

$0.410

1k+ parts

$0.370

10k+ parts

-

4,657

$0.440

$0.410

$0.370

-

AZTECH Wire

Italy . 950 parts In-Stock

1+ parts

$21.470

100+ parts

-

1k+ parts

-

10k+ parts

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950

$21.470

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 13,308 parts In-Stock

1+ parts

-

100+ parts

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13,308

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

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SupplyDigital Components

Austria . 7,867 parts In-Stock

1+ parts

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100+ parts

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7,867

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Problanco Electronics

Mexico . 7,052 parts In-Stock

1+ parts

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7,052

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Kulean Microsystems

USA . 6,993 parts In-Stock

1+ parts

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6,993

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Continental Prestige Electronics

USA . 5,200 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.388

10k+ parts

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5,200

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-

$0.388

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TANS Electronics

Latvia . 2,216 parts In-Stock

1+ parts

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100+ parts

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2,216

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UHIMA Technologies

Türkiye . 62 parts In-Stock

1+ parts

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62

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Overview

Discover the NTLGF3402PT1G by Onsemi, a high-quality Power FET that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this P-CHANNEL transistor with a built-in diode is perfect for switching applications. With a small outline package and an operating temperature range from -55 to 150 °C, this FET provides exceptional value and benefits to customers seeking efficiency and durability. Upgrade your electronic devices with the NTLGF3402PT1G and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

Allows for efficient switching of the transistor, enhancing performance in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a built-in diode for certain applications, reducing the need for additional components.

Transistor Application: SWITCHING

Optimized for switching operations, making it suitable for a wide range of electronic devices and systems.

Surface Mount: YES

Easy to install on PCBs, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 20 V

Can handle high voltages, ensuring stability and reliability in different operating conditions.

Package Shape: RECTANGULAR

Saves space on the PCB and allows for efficient placement in tight layouts.

Terminal Form: NO LEAD

Enables solderless connections for easier installation and maintenance.

Operating Mode: ENHANCEMENT MODE

Offers improved control and efficiency in various applications, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 11 A

Can handle high current pulses, making it suitable for power-intensive operations.

No. of Terminals: 6

Provides multiple connection points for versatile integration into different circuits and systems.

Package Style (Meter): SMALL OUTLINE

Offers a compact form factor for space-constrained applications, facilitating efficient PCB layout.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers high performance and reliability, ensuring consistent operation in various conditions.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, suitable for demanding industrial and automotive applications.

Transistor Element Material: SILICON

Provides excellent electrical properties and reliability, ensuring long-term performance.

Minimum Operating Temperature: -55 °C

Operates effectively in low-temperature environments, making it versatile for different applications.

Terminal Finish: TIN

Ensures reliable connections and resists corrosion for long-term performance.

Maximum Drain Current (ID): 2.3 A

Can handle moderate current loads, suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.14 ohm

Offers low resistance for efficient power transfer and reduced heat generation, enhancing overall efficiency.

Terminal Position: DUAL

Provides flexibility in circuit design and connection options, accommodating diverse application requirements.

Case Connection: DRAIN

Enables easy connection to external components, simplifying circuit integration.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes, ensuring reliable solder joints during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NTLGF3402PT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2.3 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

11 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLGF3402PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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