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NTLGF3501NT2G

Onsemi

NTLGF3501NT2G by Onsemi

NTLGF3501NT2G by Onsemi is an N-CHANNEL FET with a 20V DS Breakdown Voltage and 13.8A IDM. Ideal for SWITCHING applications, it features a 0.09 ohm Drain-Source On Resistance and operates in ENHANCEMENT MODE at up to 150 °C.

Median Price

$0.548

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 192,000 parts In-Stock

1+ parts

-

100+ parts

$0.528

1k+ parts

$0.439

10k+ parts

$0.391

192,000

-

$0.528

$0.439

$0.391

DigiKey

USA . 192,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.660

10k+ parts

-

192,000

-

-

$0.660

-

Verical

USA . 192,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.548

10k+ parts

$0.489

192,000

-

-

$0.548

$0.489

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 450 parts In-Stock

1+ parts

$0.364

100+ parts

-

1k+ parts

-

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450

$0.364

-

-

-

Digiode

USA . 198 parts In-Stock

1+ parts

$0.411

100+ parts

-

1k+ parts

-

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198

$0.411

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 207 parts In-Stock

1+ parts

$0.364

100+ parts

-

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-

207

$0.364

-

-

-

Corphita

USA . 83 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

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83

$0.390

-

-

-

Component Stockers USA

USA . 121,932 parts In-Stock

1+ parts

$0.450

100+ parts

$0.420

1k+ parts

$0.380

10k+ parts

$0.380

121,932

$0.450

$0.420

$0.380

$0.380

Continental Prestige Electronics

USA . 192,000 parts In-Stock

1+ parts

-

100+ parts

$0.520

1k+ parts

-

10k+ parts

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192,000

-

$0.520

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,201 parts In-Stock

1+ parts

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17,201

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Problanco Electronics

Mexico . 6,712 parts In-Stock

1+ parts

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6,712

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Kulean Microsystems

USA . 5,618 parts In-Stock

1+ parts

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5,618

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SupplyDigital Components

Austria . 3,567 parts In-Stock

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3,567

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TANS Electronics

Latvia . 3,470 parts In-Stock

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3,470

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Kepictronics

USA . 3,462 parts In-Stock

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3,462

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Metaverse IC Inc.

Canada . 2,962 parts In-Stock

1+ parts

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2,962

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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UHIMA Technologies

Türkiye . 887 parts In-Stock

1+ parts

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887

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Futuretech Components

Singapore . 507 parts In-Stock

1+ parts

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507

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-

Overview

Discover a new level of power efficiency and performance with the NTLGF3501NT2G by Onsemi. Built with top-quality materials and cutting-edge technology, this Power Field Effect Transistor is designed for optimal switching applications. With its single configuration and built-in diode, this transistor offers seamless operation and reliability. Perfect for a wide range of industries, this product provides value, benefits, and advantages that will elevate your projects to new heights. Trust Onsemi for superior quality and innovation in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-resistance compared to P-Channel FETs, providing better efficiency and performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient flyback protection and helps in reducing external component count, simplifying circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current in electronic devices, making it a reliable choice for power management.

Surface Mount: YES

Suitable for surface mount PCB assembly, making it easy to integrate into compact electronic devices and ensuring a smaller footprint on the board.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20 V, this FET can handle higher voltage levels, providing a margin of safety in applications where voltage spikes may occur.

Maximum Drain Current (ID): 2.8 A

Capable of handling a maximum drain current of 2.8 A, making it suitable for medium power applications where a stable and reliable current flow is required.

Maximum Drain-Source On Resistance: 0.09 ohm

With a low drain-source on resistance of 0.09 ohm, this FET minimizes power loss and heat generation, improving overall efficiency in the circuit.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150 °C, allowing for use in high-temperature environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NTLGF3501NT2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2.8 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

13.8 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLGF3501NT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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