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NTLGF3402PT2G

Onsemi

NTLGF3402PT2G by Onsemi

NTLGF3402PT2G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage and 11A IDM. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 0.14 ohm RDS(ON) and -55 to 150 °C temperature range.

Median Price

$0.521

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 117,000 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

117,000

-

$0.502

$0.417

$0.371

DigiKey

USA . 117,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

-

117,000

-

-

$0.630

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Verical

USA . 117,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

117,000

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,408 parts In-Stock

1+ parts

$0.391

100+ parts

-

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2,408

$0.391

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Vyrian

USA . 1,095 parts In-Stock

1+ parts

$0.412

100+ parts

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1,095

$0.412

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,310 parts In-Stock

1+ parts

$0.371

100+ parts

-

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1,310

$0.371

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Corohmni

South Africa . 375 parts In-Stock

1+ parts

$0.412

100+ parts

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375

$0.412

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Continental Prestige Electronics

USA . 117,000 parts In-Stock

1+ parts

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100+ parts

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$0.378

10k+ parts

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117,000

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-

$0.378

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QUARKTWIN TECHNOLOGY LTD

USA . 16,610 parts In-Stock

1+ parts

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16,610

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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SupplyDigital Components

Austria . 5,654 parts In-Stock

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5,654

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Problanco Electronics

Mexico . 5,224 parts In-Stock

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5,224

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A-Z Elektronik GmbH

Germany . 4,599 parts In-Stock

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4,599

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Kulean Microsystems

USA . 4,179 parts In-Stock

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4,179

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TANS Electronics

Latvia . 4,170 parts In-Stock

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4,170

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UHIMA Technologies

Türkiye . 917 parts In-Stock

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917

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Overview

Upgrade your power management solutions with the NTLGF3402PT2G by Onsemi. Designed with superior quality and precision by one of the leading manufacturers in the industry, this P-Channel Power Field Effect Transistor offers unmatched performance for switching applications. With a built-in diode and a compact design, this transistor provides efficient power control and enhanced reliability. Experience seamless operation and increased productivity with this advanced technology at your fingertips. Trust Onsemi to deliver exceptional value and innovation for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and reliability to the power FET, ensuring it can withstand harsh operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high input impedance, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltages effectively, making it suitable for various applications.

Maximum Pulsed Drain Current (IDM): 11 A

The high maximum pulsed drain current allows the FET to handle sudden high currents efficiently, making it reliable for transient load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low leakage current and high switching speeds, making the FET ideal for high-performance applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures that the FET can withstand elevated temperatures without compromising its performance.

Maximum Drain-Source On Resistance: 0.14 ohm

The low on-resistance of 0.14 ohms minimizes power losses and heat generation, improving the efficiency of the power FET.

Technical Specifications

Power Field Effect Transistors (FET) NTLGF3402PT2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2.3 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

11 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLGF3402PT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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