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NTLGD3502NT1G

Onsemi

NTLGD3502NT1G by Onsemi

NTLGD3502NT1G by Onsemi is an N-channel Power FET with 20V DS breakdown voltage and 0.06 ohm max RDS(on). It features a series configuration with 2 elements and built-in diode, suitable for enhancement mode operation. Ideal for applications requiring high pulsed drain current up to 17.2A in a small outline package.

Median Price

$0.561

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,910 parts In-Stock

1+ parts

$1.510

100+ parts

$0.654

1k+ parts

$0.566

10k+ parts

-

2,910

$1.510

$0.654

$0.566

-

Rochester

USA . 14,990 parts In-Stock

1+ parts

-

100+ parts

$0.542

1k+ parts

$0.450

10k+ parts

$0.401

14,990

-

$0.542

$0.450

$0.401

DigiKey

USA . 14,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.560

10k+ parts

-

14,990

-

-

$0.560

-

Verical

USA . 8,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.562

10k+ parts

$0.501

8,990

-

-

$0.562

$0.501

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,088 parts In-Stock

1+ parts

$0.422

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

$0.422

-

-

-

Vyrian

USA . 1,598 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,598

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 719 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

719

$0.400

-

-

-

Corohmni

South Africa . 398 parts In-Stock

1+ parts

$0.444

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$0.444

-

-

-

Component Stockers USA

USA . 12,929 parts In-Stock

1+ parts

$0.450

100+ parts

$0.430

1k+ parts

$0.390

10k+ parts

$0.390

12,929

$0.450

$0.430

$0.390

$0.390

AZTECH Wire

Italy . 1,138 parts In-Stock

1+ parts

$14.600

100+ parts

-

1k+ parts

-

10k+ parts

-

1,138

$14.600

-

-

-

Perfect Parts

USA . 19,757 parts In-Stock

1+ parts

-

100+ parts

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19,757

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-

-

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Continental Prestige Electronics

USA . 14,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.432

10k+ parts

-

14,990

-

-

$0.432

-

TANS Electronics

Latvia . 7,919 parts In-Stock

1+ parts

-

100+ parts

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7,919

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-

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A-Z Elektronik GmbH

Germany . 6,771 parts In-Stock

1+ parts

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100+ parts

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6,771

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-

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Kulean Microsystems

USA . 4,696 parts In-Stock

1+ parts

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4,696

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-

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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-

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Authorized Procurement Solutions

USA . 2,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,910

-

-

-

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GreenTree Electronics

Israel . 2,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,910

-

-

-

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SupplyDigital Components

Austria . 1,728 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,728

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-

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Problanco Electronics

Mexico . 558 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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558

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UHIMA Technologies

Türkiye . 83 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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83

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Overview

Unlock the power of efficient energy management with the NTLGD3502NT1G by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors, Onsemi delivers top-notch quality and reliability. Ideal for applications requiring N-CHANNEL configuration with built-in diode, this product offers seamless integration and enhanced performance. With a focus on value and customer satisfaction, the NTLGD3502NT1G boasts maximum drain current and minimum DS breakdown voltage for optimal functionality. Upgrade your systems with this cutting-edge solution and experience the difference in efficiency and productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the FET, ensuring reliable performance and durability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have better performance and efficiency compared to P-CHANNEL FETs, making this product a good choice for power applications.

Configuration: SERIES, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for more efficient power handling and protection, making it a versatile choice for various circuit designs.

Surface Mount: YES

Surface mount FETs are easier to integrate into PCBs and save space, making this product suitable for compact designs.

Minimum DS Breakdown Voltage: 20 V

This voltage rating ensures that the FET can handle moderate power levels without breakdown, making it suitable for a range of applications.

Maximum Pulsed Drain Current (IDM): 17.2 A

The high pulsed drain current rating allows for peak power handling, making this FET suitable for high-performance applications.

Maximum Drain Current (ID): 4.3 A

The high drain current rating ensures reliable operation under sustained load, making this FET suitable for continuous power delivery.

Maximum Drain-Source On Resistance: 0.06 ohm

The low on-resistance of the FET reduces power losses and improves efficiency, making it a cost-effective choice for power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTLGD3502NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

4.3 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

17.2 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

NTLGD3502NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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