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NTD4906NT4G

Onsemi

NTD4906NT4G by Onsemi

NTD4906NT4G by Onsemi is an N-channel Power FET with a 30V DS breakdown voltage and 223A pulsed drain current, ideal for switching applications. It features a built-in diode, 0.008 ohm max on-resistance, and operates in enhancement mode. The small outline package with gull wing terminals ensures efficient heat dissipation up to 175 °C.

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 38 parts In-Stock

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$0.460

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$0.350

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38

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Vyrian

USA . 5,888 parts In-Stock

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Digiode

USA . 869 parts In-Stock

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Bristol Electronics

USA . 188 parts In-Stock

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Dan-Mar Components

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Distributors (Availability)

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Corohmni

South Africa . 322 parts In-Stock

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AZTECH Wire

Italy . 213 parts In-Stock

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$20.290

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Perfect Parts

USA . 14,603 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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SupplyDigital Components

Austria . 8,272 parts In-Stock

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Kulean Microsystems

USA . 5,367 parts In-Stock

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TANS Electronics

Latvia . 3,348 parts In-Stock

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Problanco Electronics

Mexico . 2,746 parts In-Stock

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S.R.D Solutions

India . 2,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,937 parts In-Stock

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GreenTree Electronics

Israel . 1,127 parts In-Stock

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Corphita

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 818 parts In-Stock

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Futuretech Components

Singapore . 510 parts In-Stock

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Overview

Enhance the power and efficiency of your electronic devices with the NTD4906NT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Power Field Effect Transistors that are perfect for switching applications. With its N-CHANNEL design and built-in diode, this transistor offers enhanced performance and reliability. Whether you're working on industrial equipment or consumer electronics, the NTD4906NT4G provides exceptional value with its low on-resistance and high current capabilities. Upgrade your designs today and experience the difference with Onsemi's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and lower resistance compared to P-channel transistors, making this product efficient for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy reverse bias protection and can prevent damage to the circuit, enhancing the reliability of the product.

Transistor Application: SWITCHING

Specifically designed for switching applications, this transistor offers fast switching speeds and low on-resistance, making it suitable for efficient power management.

Surface Mount: YES

Surface mount technology saves space and reduces the overall size of the device, making it ideal for compact electronic designs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Maximum Drain Current (ID): 14 A

Capable of handling a maximum drain current of 14A, this transistor can provide high power output while maintaining efficiency and reliability.

Maximum Power Dissipation (Abs): 37.5 W

The high power dissipation rating of 37.5W ensures that the transistor can handle heavy loads and operate effectively even under high power conditions.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can withstand high temperatures and operate reliably in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NTD4906NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

223 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4906NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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