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NTD4906N-35G

Onsemi

NTD4906N-35G by Onsemi

NTD4906N-35G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 223A IDM, and 0.008 ohm RDS. Ideal for SWITCHING applications, it features an N-CHANNEL configuration in a PLASTIC/EPOXY package with built-in DIODE. Operating in ENHANCEMENT MODE, it has a max power dissipation of 37.5W at 175 °C max temp.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 676,661 parts In-Stock

1+ parts

-

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$0.251

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$0.208

10k+ parts

$0.186

676,661

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$0.251

$0.208

$0.186

Verical

USA . 635,182 parts In-Stock

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$0.232

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$0.232

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Digiode

USA . 1,215 parts In-Stock

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$0.196

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$0.196

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LIBRA Elektronik GmbH

Germany . 4,340 parts In-Stock

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Vyrian

USA . 1,926 parts In-Stock

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Corphita

USA . 2,256 parts In-Stock

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$0.185

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$0.185

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Corohmni

South Africa . 343 parts In-Stock

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$0.206

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343

$0.206

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AZTECH Wire

Italy . 832 parts In-Stock

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$17.310

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832

$17.310

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Perfect Parts

USA . 25,407 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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SupplyDigital Components

Austria . 7,923 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,536 parts In-Stock

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TANS Electronics

Latvia . 4,249 parts In-Stock

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Kulean Microsystems

USA . 3,376 parts In-Stock

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Problanco Electronics

Mexico . 1,865 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 565 parts In-Stock

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Overview

Unleash the power of the NTD4906N-35G by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers unparalleled performance and reliability. From its robust design to its impressive maximum drain current of 14 A, this product delivers exceptional value and benefits to customers looking for efficient solutions in their projects. Trust in Onsemi's expertise and choose the NTD4906N-35G for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and durable, perfect for use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in high-side switching applications, offering efficient performance and low on-resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling and protection against reverse polarity, enhancing the overall reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and low power dissipation, ideal for power management applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 223 A

The high pulsed drain current rating of 223 A allows for handling large current spikes, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 37.5 W

With a maximum power dissipation of 37.5 W, this FET can handle high power levels without overheating, ensuring reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this FET a good choice for demanding applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can operate in high-temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.008 ohm

The low on-resistance of 0.008 ohm reduces power loss and improves efficiency in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4906N-35G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

223 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4906N-35G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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