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NTD4863NA-1G

Onsemi

NTD4863NA-1G by Onsemi

Onsemi's NTD4863NA-1G is a Power FET with 25V DS Breakdown Voltage, 98A IDM, and 0.014 ohm RDS(on). Ideal for SWITCHING applications, it features N-CHANNEL polarity, SINGLE configuration with BUILT-IN DIODE. Package: PLASTIC/EPOXY RECTANGULAR IN-LINE with THROUGH-HOLE terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,591 parts In-Stock

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Digiode

USA . 2,107 parts In-Stock

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AZTECH Wire

Italy . 847 parts In-Stock

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Kulean Microsystems

USA . 8,142 parts In-Stock

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TANS Electronics

Latvia . 7,878 parts In-Stock

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Problanco Electronics

Mexico . 4,369 parts In-Stock

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SupplyDigital Components

Austria . 2,855 parts In-Stock

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Corphita

USA . 628 parts In-Stock

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UHIMA Technologies

Türkiye . 244 parts In-Stock

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Corohmni

South Africa . 83 parts In-Stock

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Overview

Experience the power of the NTD4863NA-1G by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. With a single configuration and built-in diode, this N-channel transistor offers exceptional performance and reliability. Whether you are looking to enhance your circuit design or improve efficiency, this transistor is a game-changer. Trust in Onsemi's reputation for excellence and unlock the full potential of your projects with the NTD4863NA-1G. Upgrade your electronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for applications where weight and durability are important factors.

Minimum DS Breakdown Voltage: 25 V

With a high minimum breakdown voltage, this FET can handle higher voltages without failure, making it suitable for a wide range of applications requiring robust performance.

Maximum Pulsed Drain Current (IDM): 98 A

The high maximum pulsed drain current capability allows the FET to handle large currents for short periods, making it suitable for applications requiring surge current handling.

Avalanche Energy Rating (EAS): 60.5 mJ

The high avalanche energy rating of this FET makes it suitable for applications where energy spikes or transient voltages may occur, providing protection against voltage transients.

Maximum Drain Current (ID): 9.2 A

The high maximum drain current rating allows the FET to handle continuous high power loads without overheating, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.014 ohm

With a low drain-source on resistance, this FET can switch high currents efficiently with minimal power loss, making it ideal for high-performance power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4863NA-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

60.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

9.2 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

98 A

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD4863NA-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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